Abstract: A simple and universal technique for fabricating different antenna structures, in particular a multilayer antenna structure, on a substrate is disclosed. Before the antenna is actually fabricated or placed on the substrate, connecting surfaces for connecting an antenna conductor and/or a chip or a chip module as well as through-platings extending through the antenna substrate are prepared between the connecting surfaces.

Abstract: A method of producing an electronic module with at least one electronic component and one carrier. A structure is provided on the carrier so that the electronic component can take a desired target position relative to the structure. The structure is coated with a liquid meniscus suitable for receiving the electronic component. Multiple electronic components are provided at a delivery point for the electronic components. The carrier, with the structure, is moved nearby and opposite to the delivery point, where the delivery point delivers one of the electronic components without contact, while the structure on the carrier is moving near the delivery point, so that after a phase of free movement the electronic component at least partly touches the material, and the carrier, with the structure, is moved to a downstream processing point, while the electronic component aligns itself to the structure on the liquid meniscus.

Abstract: An identification document has a substrate and a laminating film bonded to the substrate. The surface of the substrate facing the laminating film bears first text, numeric and/or image data detectable with the naked eye at least when illuminated by daylight and a first zone with a fluorescent substance. Under excitation with light in a specific wavelength range the substance fluoresces in colour in a manner detectable with the naked eye. The laminating film has a second zone which bears second text, numeric and/or image data. The first zone of the surface of the substrate and the second zone of the laminating film overlap one another at least partially.

Abstract: In a method for producing an apparatus for wireless communication, particularly a contactless card, a E-passport, a Smart label or the like, or for producing a prelaminate for such an apparatus, an antenna is produced by applying an antenna structure to a substrate using an additive method, such as metal deposition. The substrate can be made of a PVC or polycarbonate material. A transponder is then produced by connecting a bare chip to the antenna using a direct assembly process, such as a flip-chip process. In a next step, the apparatus or the prelaminate for the apparatus is produced by connecting the transponder to further layers using a laminating method, wherein at least one of the further layers in directly adjoining relationship to the substrate is made of a same material as the substrate.