Abstract: A method for forming a conductive track on a surface (21) of a substrate (11) that includes providing the substrate (11), wherein the substrate (11) comprises deposited material (23) along a path on a surface (21) of the substrate (11). Generating a laser beam having an optical axis and an energy distribution within a cross-sectional area of the laser beam incident on the surface (21). The energy distribution of the laser beam is non-circularly symmetric about the optical axis at the surface (21). The method further includes directing the laser beam to move along the path to irradiate the deposited material (23) to provide a conductive track along the path. A selected orientation of the energy distribution within the cross-sectional area is aligned with the direction of movement of the laser beam.

Abstract: A method of forming an electrode structure for a capacitive touch sensor in a first transparent conductive layer (19) which is located on a first side of a glass substrate (5) on the second side of which is a color filter layer (11,12,13) over-coated with a transparent non-conductive layer (15) and a second transparent conductive layer (7), by a direct write laser scribing process using a pulsed solid state laser (22), the laser wavelength in the range 257 nm to 266 nm and a pulse length in the range 50 fs to 50 ns so grooves (21) are formed in the first transparent conductive layer (19) to electrically isolate areas of the first transparent conductive layer (19) on opposite sides of each groove (21). This selection of wavelength and pulse length enables the grooves (21) to be formed with substantially no damage to the underlying color filter layer (11, 12, 13), the transparent non-conductive layer (15) or the second transparent conductive layer (7) on the second side of the glass substrate (5).

Abstract: A method of forming an electrode structure for a capacitive touch sensor in a transparent conductive layer located on a transparent non-conductive layer which is located on a color filter layer by a direct write laser scribing process using a pulsed solid state laser, the laser wavelength, pulse length and beam profile at the substrate being selected to have a wavelength in the range 257 nm to 266 nm, a pulse length in the range 50 fs to 50 ns, and a top hat beam profile having a uniformity of power or energy density between a value (Emax) and a minimum value (Emin) of less than 10%, where uniformity is defined as (Emax?Emin)/(Emax+Emin). 1 Grooves can thus be formed in the transparent conductive layer to electrically isolate areas of the transparent conductive layer on opposite sides of each groove with substantially no damage to the transparent non-conductive layer or the color filter layer beneath the transparent conductive layer.

Abstract: The present invention provides a method for forming a conductive track on a surface (21) of a substrate (11). The method comprises providing a substrate (11), wherein the substrate (11) comprises deposited material (23) along a path on a surface (21) of the substrate (11). Generating a laser beam having an optical axis and an energy distribution within a cross-sectional area of the laser beam incident on the surface (21). The energy distribution of the laser beam is non-circularly symmetric about the optical axis at the surface (21). The method further comprises directing the laser beam to move along said path to irradiate the deposited material (23) to provide a conductive track along said path. A selected orientation of the energy distribution within the cross-sectional area is aligned with the direction of movement of the laser beam.

Abstract: A method and apparatus is described that allows accurate control of the width of fine line structures ablated by lasers in thin films on substrates when using scanner and focussing lens systems. The method provides dynamic compensation for optical distortions introduced by the scan lens at off axis points by increasing the laser power or energy in the beam in order to overcome the reduction in power or energy density.

Abstract: The present application describes a method for laser scribing first and second transparent electrically conductive layers (14, 14?) deposited on respective opposing first and second surfaces (12, 13) of a transparent substrate (11), the method comprising: directing a first laser beam (21) through one or more lenses (22) to a focal spot on or closely adjacent to the first surface (12) of the substrate (11), such that the focusing laser beam (21) passes through the second electrically conductive layer (14?) and the second surface (13) of the substrate (11); initiating relative movement between the first laser beam (21) and the substrate (11) in two axes in a plane orthogonal to the axis of the first laser beam (21) to scribe a first pattern in the first electrically conductive layer (14); directing a second laser beam (21?) through one or more lenses (22?) to a focal spot on or closely adjacent to the second surface (13) of the substrate (11), such that the focusing laser beam (21?) passes through the first ele

Abstract: A process head for processing a substrate using a laser beam, comprising: an optical unit including at least one optical element for directing the laser beam; a plurality of Bernoulli air bearings arranged to surround an optical axis of the optical element and configured to eject a first fluid flow for producing an attractive force between said Bernoulli air bearing and said substrate by the Bernoulli principle, so as to maintain a substantially constant spacing between said optical element and said substrate.

Abstract: Apparatus and methods are disclosed for performing laser ablation. In an example arrangement a spatial light modulator (54) is used to modulate a pulsed laser beam from a solid state laser (52). A two-stage de-magnification process (58, 62) is used to allow radiation intensity to be kept relatively low at the spatial light modulator (54) while allowing access to feedback sensors (64) in an intermediate imaging plane.

Abstract: An apparatus for and a method of forming a plurality of groups of laser beams (2, 2?, 2?) are defined. Each group (2, 2?, 2?) may comprise two or more laser beams. The apparatus comprises a first diffractive optical element (3, referred as DOE) and a second diffractive optical element (8), the first DOE (3) being arranged to receive a first laser beam (1) and to divide this into a plurality of second laser sub-beams and the second DOE (8) being arranged to receive said plurality of second laser sub-beams and to divide each of these into two or more groups of third laser sub-beams (2, 2?, 2?), the separation of the groups in a direction perpendicular to a first axis being adjustable by rotation of the first DOE (3) about its optical axis and the separation of the third laser sub-beams (2, 2?, 2?) within each group in a direction perpendicular to the first axis being adjustable by rotation of the second DOE (8) about its optical axis.

Abstract: An apparatus for and a method of forming a plurality of groups of laser beams (2, 2?, 2?) are defined. Each group (2, 2?, 2?) may comprise two or more laser beams. The apparatus comprises a first diffractive optical element (3, referred as DOE) and a second diffractive optical element (8), the first DOE (3) being arranged to receive a first laser beam (1) and to divide this into a plurality of second laser sub-beams and the second DOE (8) being arranged to receive said plurality of second laser sub-beams and to divide each of these into two or more groups of third laser sub-beams (2, 2?, 2?), the separation of the groups in a direction perpendicular to a first axis being adjustable by rotation of the first DOE (3) about its optical axis and the separation of the third laser sub-beams (2, 2?, 2?) within each group in a direction perpendicular to the first axis being adjustable by rotation of the second DOE (8) about its optical axis.

Abstract: A method of forming an electrode structure for a capacitive touch sensor in a transparent conductive layer located on a transparent non-conductive layer which is located on a colour filter layer by a direct write laser scribing process using a pulsed solid state laser, the laser wavelength, pulse length and beam profile at the substrate being selected to have a wavelength in the range 257 nm to 266 nm, a pulse length in the range 50 fs to 50 ns, and a top hat beam profile having a uniformity of power or energy density between a value (Emax) and a minimum value (Emin) of less than 10%, where uniformity is defined as (Emax?Emin)/(Emax+Emin). 1 Grooves can thus be formed in the transparent conductive layer to electrically isolate areas of the transparent conductive layer on opposite sides of each groove with substantially no damage to the transparent non-conductive layer or the colour filter layer beneath the transparent conductive layer.

Abstract: A method of forming an electrode structure for a capacitive touch sensor in a first transparent conductive layer (19) which is located on a first side of a glass substrate (5) on the second side of which is a colour filter layer (11,12,13) over-coated with a transparent non-conductive layer(15) and a second transparent conductive layer (7), by a direct write laser scribing process using a pulsed solid state laser (22), the laser wavelength in the range 257 nm to 266 nm and a pulse length in the range 50 fs to 50 ns so grooves (21) are formed in the first transparent conductive layer (19) to electrically isolate areas of the first transparent conductive layer (19) on opposite sides of each groove (21). This selection of wavelength and pulse length enables the grooves (21) to be formed with substantially no damage to the underlying colour filter layer (11, 12, 13), the transparent non-conductive layer (15) or the second transparent conductive layer (7) on the second side of the glass substrate (5).

Abstract: A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cells each having a width W, which are electrically interconnected in series by interconnect structures.

Abstract: A method is described for simultaneously writing patterns in thin films of material coated on the opposite sides of thin glass or plastic substrates by direct write, laser ablation. The substrates are fully or partially transparent to the laser radiation used and in addition the surfaces of the substrates are not assumed to be flat. Different registered patterns may be applied at the same time to opposite sides of the substrates.

Abstract: A method is described for making a partially transparent thin film solar panel based on transparent glass or plastic substrates by creating an array of small light transmitting apertures through all the opaque layers by using an ink jet print head to apply droplets of an etching fluid to the top electrode layer to form apertures in the electrode layer. These apertures may then be used as a contact mask for etching holes though the underlying active layer (if this is opaque). In this second stage, the etchant may be applied using an ink jet print head or by spraying or the panel may be immersed in the etchant.

Abstract: An apparatus for laser scribing two transparent electrically conductive layers (72A,B; 73A,B) deposited on opposite surfaces of a transparent substrate (71A; 71B) comprising; a laser beam (74A), one or more lenses (75A, 76A, 77A) configured and positioned for adjusting the focal spot (78A; 78B) of the laser beam between a first position (78A) and a second position (78B), means for holding a substrate in a plane between the first and second position and means for moving the relative positions of the substrate (71A; 71B) and laser beam (74A) in two dimensions within the plane or a plane parallel to it, wherein in use, the first and second positions (78A; 78B) coincide with or are adjacent to exposed surfaces of the two transparent electrically conducting layers (72A,B; 73A,B).

Abstract: A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cells which are electrically interconnected in series.

Abstract: An apparatus and method for exposing the surface of a drum to patterned illumination from a pulsed laser source to form a dense, regular array of 3-D microstructures is provided. The method may include locating a mask relative to a target area, projecting a uniform line shaped laser beam through the mask to project an image including a plurality of features of the mask onto the target area, de-magnifying the image, rotating the drum continuously so the surface moves in a first direction perpendicular to the axis of rotation of the drum and simultaneously moving the projected beam in a second direction parallel to the axis of rotation of the drum, tilting the projected array of microstructures to correspond to the helical path followed by the laser beam on the drum surface, and controlling the pulsed laser based on an angular position of the drum.

Abstract: A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cells which are electrically interconnected in series.

Abstract: The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern.