Abstract: A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).

Abstract: An illumination head (1) for machine vision has an annular support (2) with first, second, third, and fourth illumination sections (3, 4, 5, and 6). The third section (5) has three sets of LEDs (12, 13, 14) arranged in a pattern so that each set illuminates at approximately the same angle. Each set is driven in succession so that a series of three monochrome images at the same angle are captured. These are superimposed by an image processor to provide a color image, although the camera is monochrome. More information can be obtained in such a color image and the high resolution and robustness of monochrome cameras is availed of.

Abstract: An inspection station (6) has a ring of 370 nm LEDs (24) for low-angle diffuse illumination of flux. This stimulates inherent fluorescent emission of the flux without the need for flux additives or pre-treatment. A CCD sensor (20) detects the emission. An image processor generates output data indicating flux volume according to a relationship between emission intensity and volume over the surface of the flux. Intensity non-uniformity indicates either height non-uniformity or hidden voids, both of which give rise to defects after application of solder paste and reflow. The inspection is particularly effective for pre solder application flux inspection.

Abstract: A system has a projection lens directing on-axis light and low level LEDs directing light to blind microvias. A high resolution camera captures blind microvia images and an image processor recognizes defects according to classifications according to reflected light area and centroid position. The lens is telecentric for particularly effective image capture in blind microvias. The system also has an array of 6000 back lighting LEDs providing illumination for capture of images by a camera. These images are analyzed by the image processor to detect defects such as blocked through microvias.

Abstract: A closed loop controller (6) has a measurement server (11) which captures measurement data from a measurement machine (3) via a link (22). It also receives production data indicating which placement machine parts were involved in depositing inspected items, via links (20, 21). The server (11) correlates this data and transmits it via a link (23) to a closed loop client (10), which generates process engineer displays of the correlated data and generates a control signal for the placement machine (2). These are fed back via a link (24) for automatic closed loop control.

Abstract: A measurement system (1) has robotic system (3) mounted over a base plate (2) which provides a vertical height reference. In the optical head (8), a CCD camera (17) is adjustable to be pre-set in height. The optical head (8) also has an upper light source (18) comprising LEDs and a lower light source (25) comprising a white fluorescent lamp (26) for lateral component illumination. An air flow system (45) directs cooling air in a swirling motion around the tube. An image analysis computer (10) automatically performs various tests to co-ordinate optical and mechanical operation.