Abstract: A printed circuit board is formed by preparing at least one surface of a substrate with a pattern including selected areas for receiving metal, and non-selected areas to which metal will not adhere; the surface is then plasma sprayed with metal to coat the selected areas.
Abstract: A printed circuit board is formed by selectively conditioning at least one surface of a substrate with a pattern including selected areas conditioned to receiving metal, and non-selected areas to which metal will not adhere; the surface is then plasma sprayed with metal to coat the selectively prepared areas.