Abstract: A printed circuit board is formed by preparing at least one surface of a substrate with a pattern including selected areas for receiving metal, and non-selected areas to which metal will not adhere; the surface is then plasma sprayed with metal to coat the selected areas.
Abstract: A printed circuit board is formed by selectively conditioning at least one surface of a substrate with a pattern including selected areas conditioned to receiving metal, and non-selected areas to which metal will not adhere; the surface is then plasma sprayed with metal to coat the selectively prepared areas.
Abstract: A laminated circuit board comprising a high frequency, low dielectric, and low dissipation factor foam substrate layer and at least one metal cladding layer laminated to the foam substrate layer. The foam substrate layer is formed of a closed-cell polyisocyanurate rigid foam having a closed-cell structure greater than 95%.