Abstract: A method utilizes a keyword based rule set to crawl through the web pages and fetch the related product prices. There are many algorithms involved for accurately matching and selecting the required items. The data is then sorted by the price and brand and compared with the database of a group of known products. The prices of the known products are then adjusted via a set of built-in rules to put them in a very competitive position, such as number 1 or 2 among the same product category. The new prices make the seller's products very competitive online. The new price list will then automatically be posted to the web server to replace the old prices. The whole process is automated by simply placing the program on a computer operating system scheduler and let it run periodically according to the specified date and time.

Abstract: An air purifier is constructed to include a conduit housing a high voltage circuit board and a high voltage generator in a rear section thereof and at least one high voltage electrode and a number of ground electrodes in a front section thereof, the high voltage electrode and ground electrodes functioning as an ionizer as well as an electrostatic precipitator, trapping and removing contaminants from the air when receiving a high voltage output from the high voltage generator, so that air flowing by the high voltage electrode gets ionized and, floating contaminant particles are then combined with air ions, which are drawn to the ground electrodes and get trapped and neutralized by the ground electrodes.

Abstract: A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.

Abstract: A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.

Abstract: A memory module has memory chips in stacks. The lower memory chip in a stack has pins that are soldered to pads on the module substrate. A hollowed printed-circuit board (PCB) has a hollow opening on the bottom with about the same width, length, and depth as the top cap of the lower memory chip. The hollowed PCB fits over the top cap of the lower memory chip and has lower pads on its lower surface but outside of the hollow opening. The lower pads are soldered to the top shoulders of the pins of the lower memory chip. An upper memory chip has pins that are soldered to pads on the upper surface of the hollowed PCB. The hollowed PCB has a metal trace that re-routes a second bank-select signal from a no-connect pin of the lower memory chip to a bank-select pin of the upper memory chip.

Abstract: A memory module has DRAM chips mounted on both a front and a back surface but decoupling capacitors mounted on only the front surface. Each decoupling capacitor is for suppressing current spikes from a pair of DRAM chips. The pair of DRAM chips includes a first DRAM chip on the same surface as the capacitor and a second DRAM chip opposite the first DRAM chip on the back surface of the module. The first DRAM chip belongs to a first bank while the second DRAM chip belongs to a second bank. Two RAS signals are for controlling access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one DRAM chip in the pair of DRAM chips creates a current spike at any time. Thus a capacitor can be shared between the two DRAM chips in the pair. The shared capacitor can be mounted next to or under one of the DRAM chips, or formed within the multi-layer substrate itself.

Abstract: A processor module has a cache of SRAM chips mounted on both a back and a front surface but de-coupling capacitors mounted on only the back surface. Each de-coupling capacitor is for suppressing current spikes from a pair of SRAM chips. The pair of SRAM chips includes a first SRAM chip on the same surface as the capacitor and a second SRAM chip opposite the first SRAM chip on the front surface of the module. The first SRAM chip belongs to a first bank while the second SRAM chip belongs to a second bank. Two chip-enable signals control access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one SRAM chip in the pair of SRAM chips creates a current spike at any time. Thus, a capacitor can be shared between the two SRAM chips in the pair. The shared capacitor can be mounted next to or under one of the SRAM chips, or formed within the multi-layer substrate itself.

Abstract: A processor module has a cache of SRAM chips mounted on both a back and a front surface but de-coupling capacitors mounted on only the back surface. Each de-coupling capacitor is for suppressing current spikes from a pair of SRAM chips. The pair of SRAM chips includes a first SRAM chip on the same surface as the capacitor and a second SRAM chip opposite the first SRAM chip on the front surface of the module. The first SRAM chip belongs to a first bank while the second SRAM chip belongs to a second bank. Two chip-enable signals control access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one SRAM chip in the pair of SRAM chips creates a current spike at any time. Thus, a capacitor can be shared between the two SRAM chips in the pair. The shared capacitor can be mounted next to or under one of the SRAM chips, or formed within the multi-layer substrate itself.

Abstract: A memory module has DRAM chips mounted on both a front and a back surface but decoupling capacitors mounted on only the front surface. Each decoupling capacitor is for suppressing current spikes from a pair of DRAM chips. The pair of DRAM chips includes a first DRAM chip on the same surface as the capacitor and a second DRAM chip opposite the first DRAM chip on the back surface of the module. The first DRAM chip belongs to a first bank while the second DRAM chip belongs to a second bank. Two RAS signals are for controlling access to the two banks. Since only one bank is accessed at any time, and access causes current spikes, only one bank and only one DRAM chip in the pair of DRAM chips creates a current spike at any time. Thus a capacitor can be shared between the two DRAM chips in the pair. The shared capacitor can be mounted next to or under one of the DRAM chips, or formed within the multi-layer substrate itself.

Abstract: A circuit board fabrication apparatus and method having a vibratory feeder tray is disclosed. The feeder tray is preferably of low mass and horizontally-disposed and has multiple grooves which closely fit electronic parts, and hollowed-out bottom portions, generally below the rails separating the grooves. The hollow portions significantly contribute to low mass. Almost 50% of the mass of the tray's top plate may be removed. The parts are picked up one at a time and placed at precise positions on circuit board substrates by the rotating nozzles of a pick-and-place turret. An electromagnetic coil operating below the grooves of the feeder tray smoothly and continuously advances the parts in the grooves to the region in which they are picked up by the nozzles. Additionally, a slider table supporting the vibratory feeder tray positions each groove of the feeder tray in turn at the uptake point of the turret.

Abstract: A container for memory modules comprising a generally rectangular shape with a lid and tray with a multitude of finger-like protrusions forming vertical slots therebetween for receiving memory modules. The interior is formed such that a cavity may be created above and below the memory modules contained inside providing a buffer region, which protects the contents from damage when the exterior of the container is subjected to physical contact.

Abstract: An add-on card which has a flat surface on the top side on which a plastic quad flat pack integrated circuit packaged integrated circuit can be soldered upon. The other side of the add-on card has downwardly protruding pins that can plug into a pin grid array integrated circuit socket. A method of manufacturing a add-on card whereby bonding pads are disposed on one side of the add-on card and pins are disposed on the other side of the add-on card.

Abstract: A container for memory modules comprising a generally rectangular shape with a lid and tray with a multitude of finger-like protrusions forming vertical slots therebetween for receiving memory modules. The interior is formed such that a cavity may be created above and below the memory modules contained inside providing a buffer region, which protects the contents from damage when the exterior of the container is subjected to physical contact.

Abstract: An add-on card which has a flat surface on the top side on which a plastic quad flat pack integrated circuit packaged integrated circuit can be soldered upon. The other side of the add-on card has downwardly protruding pins that can plug into a pin grid array integrated circuit socket. A method of manufacturing a add-on card whereby bonding pads are disposed on one side of the add-on card and pins are disposed on the other side of the add-on card.

Abstract: A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.