Abstract: A new printed wiring board connection apparatus is provided. The apparatus comprises a spacer made of synthetic resin insulation material with pin support spaces bored within it, connection pins of elastic wire each having at least one bent portion with an end thereof being bent outwardly are inserted into the pin support spaces of the spacer such that they are resiliently secured therewithin with the aid of pin engagement holes formed in the pin support spaces which receive the bent ends of the connection pins while the bent portions and opposite ends thereto of the connection pins protrude from the spacer. The aforesaid apparatus is used to connect two printed wiring boards in such a way that protruding portions of the connection pins are inserted into throughholes of the printed wiring boards.