Abstract: An electroplating bath for depositing chromium or chromium alloys from a trivalent chromium bath that includes: (1) at least one trivalent chromium ion, (2) at least one complexing agent, (3) at least one halogen salt, and (4) at least one stabilizing agent which is different from the complexing agent, wherein the electroplating bath has a pH from 4 to 7 and is substantially free of divalent sulphur compounds and boric acid, its salts and/or derivatives and wherein the molar ratio of the complexing agent to the trivalent chromium ion is from 8:1 to 15:1. A process for depositing chromium or chromium alloys onto a substrate is also included.

Abstract: An article including a substrate having on at least a portion of its surface a multilayer coating. The multilayer coating including at least one layer of electroless nickel overlying the portion of the surface, at least one layer of electrolytic nickel overlying the layer of electroless nickel, and at least one layer of an electrolytic tin-nickel overlying the layer of electrolytic nickel.

Abstract: A ternary zinc-nickel-iron alloy and aqueous alkaline electrolyte for electroplating the alloy includes zinc, nickel, and a complex of an iron salt.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A liquid applied photoresist composition is disclosed which exhibits a favorable balance of photospeed and overall physical properties. The photoresist composition includes a binder, a multifunctional monomer, a photoinitiator, and a solvent. The photoinitiator is present in the photoresist in an amount of greater than about 10% by weight of the photoresist without solvent. The photoresist when applied is relatively resistant to blocking when applied to a substrate. A process for producing a negative resist image on a surface using the photoresist is also disclosed.

Abstract: A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

Abstract: A composition and process for cleaning inks and organic residues from various substrates utilizing dimethyl piperidone and other safe solvents is revealed. The composition and process are particularly useful in cleaning printing plates and printing apparatus.

Abstract: Tin or tin alloys, and any underlying copper-tin intermetallic, are stripped from copper surfaces utilizing an aqueous solution comprising nitric acid, sulfamic acid and a mono, di, or tri hydroxyl benzene.

Abstract: A photosensitive resin, process for its use, and printing plates formed thereby are disclosed wherein the photosensitive resin comprises (i) a polyurethane prepolymer which is the reaction product of at least one polyether diol having olefin unsaturation equal to or less than 0.01 meq/gm, at least one diisocyanate, and a hydroxy-functionalized (meth)acrylate, (ii) at least one monomer and (iii) at least one photoinitiator.

Abstract: A process is described for increasing the adhesion of organic coatings to metal surfaces, particularly aluminum and aluminum alloys. The process involves the utilization of an adhesion promoting composition in conjunction with a chromating composition in treating the metal surface prior to application of the organic coating. The adhesion promoting composition comprises (i) 1,2-bis(beta-chloroethoxy)ethane, (ii) a glycol ether, (iii) an oxidizing acid and (iv) a nitro sulfonic acid.

Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering, which immersion silver plate is treated with an additive selected from the group consisting of fatty amines, fatty amides, quaternary salts, amphateric salts, resinous amines, resinous amides, fatty acids, resinous acids, ethoxylated derivatives of any of the foregoing, and mixtures of any of the foregoing. The immersion silver deposits created are resistant to electromigration.

Abstract: A photosensitive resin, process for its use, and printing plates formed thereby are disclosed wherein the photosensitive resin comprises (i) a polyurethane prepolymer which is the reaction product of at least one polyether diol having olefin unsaturation equal to or less than 0.01 meq/gm, at least one diisocyanate, and a hydroxy-functionalized (meth) acrylate, (ii) at least one monomer and (iii) at least one photoinitiator.

Abstract: A process is disclosed for plating upon a polymeric surface with improved adhesion and coverage. The process comprises plating a metallic deposit upon a polymeric surface which has not been completely polymerized and then further curing the plated upon surface.

Abstract: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a benzotriazole with an electron withdrawing group in the 1-position which electron withdrawing group is a stronger electron withdrawer than a hydrogen group, and optionally, a source of adhesion enhancing species selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates, isopoly or heteropoly acids of molybdenum, tungsten, tantalum, niobium, vanadium, and combinations of any of the foregoing in order to increase the adhesion of polymeric materials to the metal surface.

Abstract: A process is described for treating metal surfaces with a composition comprising an oxidizer, an acid, a corrosion inhibitor, a source of halide ions, a source of adhesion enhancing ions selected from the group consisting of molybdates, tungstates, tantalates, niobates, vanadates and mixtures thereof and optionally a water soluble polymer in order to increase the adhesion of polymeric materials to the metal surface.

Abstract: A process for improving the adhesion of a copper surface to a resinous layer, the process comprising contacting the copper layer with an adhesion promoting composition comprising a reducing agent and a metal selected from the group consisting of gold, silver, palladium, ruthenium, rhodium, zinc, nickel, cobalt, iron and alloys of the foregoing metals.

Abstract: Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising pretreating the material with a carbon black dispersion followed by a graphite dispersion before the electroplating step.