Patents Assigned to Machine Active Contact Co., Ltd.
  • Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
    Patent number: 6350957
    Abstract: A circuit board which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.
    Type: Grant
    Filed: August 7, 2000
    Date of Patent: February 26, 2002
    Assignees: Meiko Electronics, Co., Ltd., Machine Active Contact Co., Ltd.
    Inventors: Noboru Shingai, Tatsuo Wada, Katsuro Aoshima
  • Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
    Patent number: 6239983
    Abstract: A circuit board which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.
    Type: Grant
    Filed: October 15, 1998
    Date of Patent: May 29, 2001
    Assignees: Meiko Electronics Co., Ltd., Machine Active Contact Co., Ltd.
    Inventors: Noboru Shingai, Tatsuo Wada, Katsuro Aoshima
  • Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
    Patent number: 5886877
    Abstract: A circuit board, which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.
    Type: Grant
    Filed: October 9, 1996
    Date of Patent: March 23, 1999
    Assignees: Meiko Electronics Co., Ltd., Machine Active Contact Co., Ltd.
    Inventors: Noboru Shingai, Tatsuo Wada, Katsuro Aoshima