Abstract: A patterned TDI sensor comprising an array of pixels having respective sensitivities to light that varies according to a periodic pattern across said array of pixels, for high throughput applications of imaging and measurement with patterned illumination such as structured illumination, Moire techniques, 3D imaging and 3D metrology. An object is measured by scanning the object with illumination that varies periodically across the object, imaging the object with a patterned TDI sensor having a repetition length matched with the repetition length of the illumination and analyzing the output signal of the TDI sensor to extract information such as height or image of the object.

Abstract: The present invention proposes an apparatus and a method for detecting the accuracy of drilled holes on a PCB, which can detect the positions, sizes, counts, and wall roughness of drilled holes on a PCB. The apparatus comprises an optical scanning tool and a platform situated below the optical scanning tool. The optical scanning tool can be positioned and moved. Two projecting light sources of parallel light beam are installed thereon to project light to the PCB. A signal receiver is installed between the two projecting light sources. A magnification lens is installed below the signal receiver. The signal receiver receives the light signal of the two projecting light sources reflected from the PCB via the magnification lens. The platform is used to place the PCB. The platform can move with respect to the optical scanning tool to control the distance between the optical scanning tool and the platform.