Abstract: A method for forming electrical interconnects for printed circuit boards and the like includes the steps of laminating a first surface of a rigid dielectric substrate with a first conductive laminate such that the first conductive laminate extends beyond at least one edge of the dielectric substrate, patterning the first conductive laminate to define a plurality of electrical interconnects which extend beyond the edge(s) of the dielectric substrate, forming a plurality of conductive traces on a second surface of the dielectric substrate and forming a plurality of openings in the dielectric substrate, each opening extending from a first location on the first surface of the dielectric which is proximate at least one electrical interconnect to a second location on the second surface of the substrate which is proximate at least one conductive trace.

Abstract: A device used in the formation of interconnected printed circuit boards and the like, the device comprising a rigid dielectric layer; a window in the dielectric layer; and at least two interconnects. Each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window. A portion of the each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window. The interconnects do not cover the entire window.