Abstract: A heat radiator having a thermo-electric cooler uses a plurality of heat radiation modules to induce forced thermal conduction at respective hot spots. The heat radiator comprises a first heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto a heat source. The thermo-electric cooler is attached to the heat source, whereby heat will be delivered from the heat absorption terminal to the heat release terminal thereof. The heat radiator further comprises a second heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto the thermo-electric cooler. Thereby, the heat generated in a heat source, such as a central processing unit (CPU) and an accelerated graphic chip, is dissipated through not only the first heat radiation module but also the thermo-electric cooler at the second heat radiation module.