Abstract: A system, a method and a collapsible and/or folding apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a carriage attached to a frame. The carriage may move relative to the frame to direct the wire loop through the object. The apparatus may have arms on the carriage that may be folded and/or a kicker frame pivotably connected to the frame that may be retracted to reduce the overall size of the apparatus.

Abstract: A system, a method and a cutting apparatus may use a bit to cut an object. The apparatus may have a bit connected to a cutting block on a cutting apparatus. The cutting apparatus may rotate about the object while the bit may advance into the object to cut the object. The cutting apparatus may have another bit located opposite to the bit to bevel an edge of the object. The cutting system may reduce point loads and/or provide an equalized load. The cutting system may reduce tool pressures when cutting a pipe and may provide extended tool and/or bit life.

Abstract: A system, a method and a modular apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a deck attached to a frame. The deck may move relative to the frame to direct the wire loop through the object. The apparatus may have arms that may hold the object being cut. The apparatus may be configured with different cutting decks to reduce the overall size of the apparatus and/or to facilitate cutting a particular object in a particular environment.

Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.

Abstract: A system, a method and a cutting apparatus may use a bit to cut an object. The apparatus may have a bit connected to a cutting block on a cutting apparatus. The cutting apparatus may rotate about the object while the bit may advance into the object to cut the object. The cutting apparatus may have another bit located opposite to the bit to bevel an edge of the object. The cutting system may reduce point loads and/or provide an equalized load. The cutting system may reduce tool pressures when cutting a pipe and may provide extended tool and/or bit life.

Abstract: A system, a method and a modular apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a deck attached to a frame. The deck may move relative to the frame to direct the wire loop through the object. The apparatus may have arms that may hold the object being cut. The apparatus may be configured with different cutting decks to reduce the overall size of the apparatus and/or to facilitate cutting a particular object in a particular environment.

Abstract: A system, a method and a collapsible and/or folding apparatus may use a wire loop to cut an object. The apparatus may have a wire loop connected to pulleys on a carriage attached to a frame. The carriage may move relative to the frame to direct the wire loop through the object. The apparatus may have arms on the carriage that may be folded and/or a kicker frame pivotably connected to the frame that may be retracted to reduce the overall size of the apparatus.

Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.

Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.

Abstract: An apparatus, a system and a method may use a diamond-impregnated wire loop to cut an underwater pipeline. The apparatus may have a frame, a carriage attached to the frame and/or pulleys connected to the carriage. The diamond-impregnated wire loop may be connected to the pulleys. The carriage may move relative to the frame to direct the diamond-impregnated wire loop in a forward direction relative to the frame and/or through the pipeline.