Patents Assigned to Mactronix
  • Publication number: 20090026722
    Abstract: A system is disclosed for a baggage handling device to be placed between a weighing platform and a conveyor system at an airline check-in counter. The baggage handling device includes a cart portion further comprising a box frame, a set of wheels, a set of rollers, a latch mechanism and a set of handle rods, and a rail portion further comprising a rectangular frame with a set of rails and two sets of unlatch mechanisms. The set of wheels is aligned with and placed above the set of rails such that the cart portion moves along the rail portion. The latch mechanism is provided to facilitate a locked position to allow safe loading of baggage onto the cart portion.
    Type: Application
    Filed: July 28, 2007
    Publication date: January 29, 2009
    Applicant: MACTRONIX, INC.
    Inventor: John Lau
  • Patent number: 6642118
    Abstract: A method for eliminating polysilicon residue is provided by converting the polysilicon residue into silicon dioxide in two steps. A tilted ion implantation step is performed to implant oxygen ions into the polysilicon residue to rich oxygen containing of the polysilicon residue. An oxygen anneal step is subsequently performed to completely convert the rich oxygen containing polysilicon residue into silicon dioxide that can eliminate the conductivity of the polysilicon residue and prevent oxygen encroachment occurring.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: November 4, 2003
    Assignee: Mactronix International Co., Ltd.
    Inventors: Chun-Lien Su, Chun-Chi Wang, Ming-Shang Chen
  • Patent number: 5188499
    Abstract: A wafer handling apparatus having a variable pitch includes a supporting surface (12) for holding a boat (14) in a predetermined location. An elevator mechanism (20) is operable to move upward through the boat to lift wafers (16) upward into intermediate restraining combs (24) and (26). Combs (22) are disposed on the elevator mechanism (20) for holding the wafers (16) on the edges thereof. The combs (22) can have the pitch thereof varied by the operation of a cylinder (56). The combs (22) have two rotating brackets (42) and (40) disposed on the sides thereof. The brackets (42) and (40) are pivoted on an elevator bracket (28) at points (44) and (46). When the lower bracket (40) is reciprocated upward by the cylinder (56) and the associated rod (54), the space between the combs (22) decreases.
    Type: Grant
    Filed: December 14, 1990
    Date of Patent: February 23, 1993
    Assignee: Mactronix
    Inventors: Jawhorng Tarng, John I. Lau
  • Patent number: 5155888
    Abstract: A wafer lifting apparatus is comprised of guide rails (10) that are disposed on a supporting surface (22). A lifting apparatus (24) is disposed on the surface (22), having an inclined surface (26). Grooves (28) are disposed on the inclined surface and spaced apart a distance equal to that of wafers (20) in a wafer handling boat (16). The wafer handling boat (16) has the end pieces (12) and (14) urged downward into the guide rails (10) until the lowermost peripheral edges of the wafers (20) contact the grooves (28) in the inclined surface (26). When fully lowered, the rearmost ones of the wafers (20) are completely lifted out of the boat such that they are supported entirely by the grooves (28). In this manner, they can be viewed from the end of the wafer lifting apparatus. A flat finding device in the form of a flat finding cylinder (44) is also provided in an opening (38) on a supporting surface (36) for holding the boat (16).
    Type: Grant
    Filed: May 22, 1991
    Date of Patent: October 20, 1992
    Assignee: Mactronix
    Inventor: John J. Lau
  • Patent number: 4856957
    Abstract: An apparatus is disclosed for the bulk transfer of semiconductor wafers from container to container for processing in the back-to-back configuration. The apparatus includes a stage (12) for selectively raising the wafers from a boat (14) upward into a retaining mechanism (18). The wafers are confined in a back-to-back configuration through a slot (64) in the end of a back-to-back retainer (34). The back-to-back configured wafers are then removed, processed and then disposed back in the retaining mechanism (18). The back-to-back wafers are aligned with an alignment slot (76) in a preseparation retainer (36). The preseparation retainer (36) provides both alignment and a slight preseparation with respect to a separation retainer (38). The separation retainer (38) has a separation edge (118) which separates the back-to-back configured wafers into slots (104) and (108). The wafers are then removed after separation thereof.
    Type: Grant
    Filed: January 11, 1988
    Date of Patent: August 15, 1989
    Assignee: Mactronix, Inc.
    Inventors: John J. Lau, Si-Ming Fang