Abstract: An apparatus includes an electrical device and a latching micromagnetic switch that controls energy flow through the electrical device. The latching micromagnetic switch includes a cantilever, a permanent magnet, and a coil configured to latch the latching micromagnetic switch in one of two positions each time energy passes through the coil. The electrical device and the latching micromagnetic switch can be integrated on a same substrate. Otherwise, the electrical device and the latching micromagnetic switch can be located on separate substrates and coupled together. The electrical device can be a circuit, a filter, an antenna, a transceiver, or the like.

Abstract: A method, system, and apparatus for testing one or more micro-magnetic switches on a wafer is described. A magnet is positioned adjacent to a first switch on the wafer. A probe card is positioned adjacent to the first switch. The probe card mounts a first set of probes and a second set of probes. The first set of probes interface with contact areas of a coil associated with the first switch. The second set of probes interface with conductors on the wafer associated with the cantilever of the first switch. A current source is electrically coupled to the first set of probes. The current source activates the coil of the first switch using the first set of probes to switch the cantilever from a first state to a second state. A switch state monitor is electrically coupled to the second set of probes. The switch state monitor determines whether the cantilever of the first switch is in the first state prior to the current source activating the coil of the first switch.

Abstract: A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Abstract: A latching micro magnetic switch includes a magnet located proximate to a supporting structure. The magnet produces a first magnetic field with field lines symmetrically spaced about a central axis or non-uniform field lines. The switch also includes a cantilever supported by the supporting structure. The cantilever has a magnetic material and a longitudinal axis. The magnetic material makes the cantilever sensitive to the first magnetic field, such that the cantilever is configured to move between first and second states. The switch further includes a conductor located proximate to the supporting structure and the cantilever. The conductor is configured to conduct a current. The current produces a second magnetic field, which causes the cantilever to switch between the first and second states.

Abstract: Systems and methods for actuating micro-magnetic latching switches in an array of micro-magnetic latching switches are described. The array of switches is defined by Y rows aligned with a first axis and X columns aligned with a second axis. Each switch in the array of switches is capable of being actuated by a coil. In an aspect, a row of coils is moved along the second axis to be positioned adjacent to a selected one of the Y rows of switches. A sufficient driving current is proved to a selected coil in the row of coils to actuate a selected switch in the selected one of the Y rows of switches. In another aspect, a plurality of first axis drive signals and a plurality of second axis drive signals are generated. These signals drive an array of coils, wherein each coil in the array of coils is positioned adjacent to a corresponding switch in the array of switches. Each first axis drive signal is coupled to coils in a corresponding column of coils in the array of coils.

Abstract: A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

Abstract: A system and method are used to route input signals from an input node to N output nodes. The system includes an input section that receives input signals, an output section that transmits output signals based on the input signals, and a switching section. The switching section includes switches that control transmission of the input signals from the input section to the output section. The switches can be latching micro-magnetic switches that include a magnet proximate to a substrate, a cantilever coupled to the substrate and positioned proximate to the magnet, the cantilever coupled to a magnetic material, and a conductor coupled to the substrate, the conductor conducting a current that induces a first torque in the cantilever.

Abstract: Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.

Abstract: Methods, systems, and apparatuses are disclosed for magnetically-actuated relays/switches that suppress cantilever and/or hinge deformation. A permanent magnet produces a first magnetic field. A movable element is held between a pair of axially-aligned, rotationally flexible hinges. A space is present between the permanent magnet and the movable element. The space allows at least one end portion of the movable element to move toward the permanent magnet. A bar member is positioned in the space. A coil produces a second magnetic field to switch the moveable element between first and second stable states. At least the central portion of the movable element is magnetically attracted toward the permanent magnet. The bar member physically prevents the central portion of the movable element from flexing toward the permanent magnet due to the magnetic attraction.

Abstract: A method and apparatus for packaging a plurality of micro-magnetic switches is described. A bonded substrate structure includes a first substrate, a second substrate, and a magnetic layer. The first substrate has a plurality of cantilevers formed thereon. The second substrate has a first surface that is bonded to the first substrate. Each cantilever of the plurality of cantilevers on the first substrate is housed in a corresponding space formed between the first substrate and the second substrate. The magnetic layer is formed on a second surface of the first and/or second substrate to induce a magnetization in a magnetic material of each housed cantilever. The bonded substrate structure is singulated to form a plurality of separate micro-magnetic switch packages. Each micro-magnetic switch package of the plurality of micro-magnetic switch packages includes at least one housed cantilever.

Abstract: A micro-machined magnetic latching switch is described. A moveable micro-machined cantilever has a magnetic material and a longitudinal axis. The cantilever has a conducting layer. A permanent magnet produces a first magnetic field, which induces a magnetization in the magnetic material. The magnetization is characterized by a magnetization vector pointing in a direction along the longitudinal axis of the cantilever. The first magnetic field is approximately perpendicular to longitudinal axis. A three-dimensional solenoid coil produces a second magnetic field to switch the cantilever between a first stable state and a second stable state. The temporary current is input to the three-dimensional solenoid coil, producing the second magnetic field such that a component of the second magnetic field parallel to the longitudinal axis changes direction of the magnetization vector. The cantilever is thereby caused to switch between the first stable state and the second stable state.

Abstract: An apparatus includes an circuit and a latching micromagnetic switch that controls energy flow through the circuit. The latching micromagnetic switch includes a cantilever, a permanent magnet, and a coil configured to latch the latching micromagnetic switch in one of two positions each time energy passes through the coil. The electrical device and the latching micromagnetic switch can be integrated on a same substrate. Otherwise, the electrical device and the latching micromagnetic switch can be located on separate substrates and coupled together. The circuit can be a transistor or an array of transistors connected in parallel. If the circuit is an array of transistors, there can be an array of the switches, where each one of the switches is coupled to a corresponding one of the transistors. The switches are coupled to at least one of a source, drain, or gate of the corresponding transistor.

Abstract: A method, system, and apparatus for testing one or more micro-magnetic switches on a wafer is described. A magnet is positioned adjacent to a first switch on the wafer. A probe card is positioned adjacent to the first switch. The probe card mounts a first set of probes and a second set of probes. The first set of probes interface with contact areas of a coil associated with the first switch. The second set of probes interface with conductors on the wafer associated with the cantilever of the first switch. A current source is electrically coupled to the first set of probes. The current source activates the coil of the first switch using the first set of probes to switch the cantilever from a first state to a second state. A switch state monitor is electrically coupled to the second set of probes. The switch state monitor determines whether the cantilever of the first switch is in the first state prior to the current source activating the coil of the first switch.

Abstract: Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever.

Abstract: A method and apparatus for controlling the coupling of a circuit into a signal path is described. A moveable element is supported by a substrate and has a magnetic material and a long axis. At least one magnet produces a first magnetic field. The first magnetic field induces a magnetization in the magnetic material. The magnetization is characterized by a magnetization vector pointing in a direction along the long axis of the moveable element. The first magnetic field is approximately perpendicular to a major central portion of the long axis. A coil produces a second magnetic field to switch the moveable element between first and second stable states. Only temporary application of the second magnetic field is required to change direction of the magnetization vector, which causes the moveable element to switch between the first and second stable states. In the first stable state, the moveable element does not couple the circuit in series with a signal.

Abstract: Methods and systems of assembling and making laminated electro-mechanical systems and structures are described. A plurality of structural layers are formed that include at least one structural layer having a movable element formed therein. The plurality of structural layers are stacked and aligned into a stack. Each structural layer in the stack is attached to an adjacent structural layer of the stack.

Abstract: A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.

Abstract: Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.

Abstract: Micro magnetic switching apparatus includes a permanent magnet supported on a base and a coil supported by the base so as to define a plurality of sides. A plurality of latching micro magnetic relays each includes a magnetic cantilever positioned to open a first electric circuit in a first orientation and to close the first electric circuit in a second orientation. One each of the relays is mounted adjacent each of the plurality of sides of the coil and adjacent the permanent magnet so as to be latched in one of the first and second orientations when the coil is not activated and to switch to the other of the first and second orientations when the coil is activated and to be latched in the other of the first and second orientations by the permanent magnet.