Patents Assigned to Man Zai Industrial Co., Ltd.
-
Patent number: 11659687Abstract: The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.Type: GrantFiled: December 22, 2020Date of Patent: May 23, 2023Assignee: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien Wan, Cheng-Jui Wan, Chun-Hsien Su, Hui-Fen Huang
-
Patent number: 11519674Abstract: The present invention provides a gravity high-efficiency heat dissipation apparatus comprising an evaporator and a condenser. The evaporator comprises a housing, an evaporation chamber arranged at the housing, and a skived structure arranged inside the evaporation chamber. The condenser comprises an upper circulating main pipe, a lower circulating main pipe and one or a plurality of condensation pipes having an upper opening and a lower opening fluidly connected to the upper circulating main pipe and the lower circulating main pipe respectively. The upper circulating main pipe is fluidly connected to an upper side of the evaporator via a first connecting pipe and is fluidly connected to an upper side of the evaporation chamber. The lower circulating main pipe is fluidly connected to one side of the evaporator via a second connecting pipe and is fluidly connected to the evaporation chamber. A circumferential side of each of the condensation pipes has one or a plurality of heat dissipation fins formed thereon.Type: GrantFiled: July 9, 2020Date of Patent: December 6, 2022Assignee: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien Wan, Cheng-Jui Wan, Chun-Hsien Su, Hui-Fen Huang
-
Patent number: 11255586Abstract: The present invention provides a parallel-connected condensation device, comprising a front condensation unit, a rear condensation unit, and a plurality of heat dissipation fins. The front condensation unit is parallel to the rear condensation unit. The heat dissipation fins is inserted into the front condensation unit and the rear condensation unit. The front condensation unit and the rear condensation unit comprise a plurality of confluence chambers. The confluence chambers are connected with each other to form a plurality of flow channels.Type: GrantFiled: March 29, 2019Date of Patent: February 22, 2022Assignee: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien Wan, Cheng-Jui Wan, Chun-Hsien Su, Hui-Fen Huang
-
Patent number: 11219841Abstract: The present invention provides a heat exchange device featuring gas-liquid separation, comprising an evaporator unit and a condenser unit. The condenser unit comprises a central main guide tube, a plurality of condensation tubes connected to the two lateral sides of the central main guide tube, and a heat dissipation fin assembly provided on a periphery of each condensation tube. The central main guide tube comprises a gaseous-phase confluence chamber and a liquid-phase confluence chamber. The gaseous-phase confluence chamber is provided in an upper portion of the central main guide tube and communicates with the gas outlet through a gaseous-phase connection tube, and the liquid-phase confluence chamber is provided in a lower portion of the central main guide tube and communicates with the evaporation chamber through a liquid-phase connection tube.Type: GrantFiled: December 5, 2019Date of Patent: January 11, 2022Assignee: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien Wan, Cheng-Jui Wan, Chun-Hsien Su, Hui-Fen Huang
-
Publication number: 20190327864Abstract: A heat sink is applied to a display unit and has a heat conductor, at least one first cooling fan, and at least one second cooling fan. The heat conductor has a heat-conducting member, multiple first cooling fins, and multiple second cooling fins. The heat-conducting member has a base portion, an extending portion formed on the base portion, and multiple channels formed in the heat-conducting member and filled with a working fluid. The first cooling fins are formed on the base portion. The second cooling fins are formed on the extending portion. The at least one first cooling fan is disposed on the base portion. The at least one second cooling fan is disposed on the extending portion. The heat conductor can be sectioned and the working fluid can change phases for heat dissipation, providing a good heat dissipation effect to the heat sink is good.Type: ApplicationFiled: January 30, 2019Publication date: October 24, 2019Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien Wan, Cheng-Feng Wan, Hao-Hui Lin, Wei-Che Hsiao, Hsiao-Ching Chen, Tung-Hsin Liu
-
Patent number: 10443960Abstract: A heat dissipating apparatus has a phase change material evaporator, a condenser, a refrigerant output tube, and a refrigerant input tube. The evaporator has a base having an evaporation chamber, a refrigerant inlet and a refrigerant outlet, a reinforcement panel mounted in the evaporation chamber and dividing the evaporation chamber into two spaces, and multiple heat conduction fins separately arranged in the two spaces. An opening area of the refrigerant outlet is larger than an opening area of the refrigerant inlet. The evaporator, the refrigerant output tube, the condenser and the refrigerant input tube form a closed refrigerant circulation loop with a refrigerant filled therein. Gas pressure of a gas-phased refrigerant in the two spaces can be increased. With pressure difference between the refrigerant outlet and the refrigerant inlet, the gas-phased refrigerant can be accelerated to flow toward the refrigerant outlet and flowability of the refrigerant can be increased.Type: GrantFiled: October 26, 2017Date of Patent: October 15, 2019Assignee: Man Zai Industrial Co., Ltd.Inventors: Cheng-Chien Wan, Cheng-Feng Wan, Hao-Hui Lin, Tung-Hsin Liu, Wei-Che Hsiao, Hsiao-Ching Chen, Dhao-Jung Lin
-
Patent number: 10342159Abstract: A liquid heat-dissipating assembly has a heat-guiding tube assembly, multiple heat-dissipating units, and at least one heat-dissipating tube. The heat-guiding tube assembly has a first tube, a second tube, and a separating segment. The first tube has at least one first channel. The second tube has at least one second channel. The separating segment is mounted between the first tube and the second tube. The heat-dissipating units are connected with the heat-guiding tube assembly, and each heat-dissipating unit has a heat-dissipating body, a first pipe, and a second pipe. The heat-dissipating body has a passage. The first pipe is connected with the passage and the at least one first channel. The second pipe is connected with the passage and the at least one second channel. The at least one heat-dissipating tube is connected with the at least one second channel of the second tube.Type: GrantFiled: August 17, 2017Date of Patent: July 2, 2019Assignee: Man Zai Industrial Co., Ltd.Inventors: Cheng-Chien Wan, Cheng-Feng Wan, Hao-Hui Lin, Hsiao-Ching Chen, Wei-Che Hsiao, Tung-Hsin Liu
-
Patent number: 10264706Abstract: A phase change evaporator includes multiple heat-dissipating fins formed on an evaporator body of the evaporator. A cooling device includes the evaporator, a condenser, a coolant output pipe and a coolant return pipe connected between the evaporator and the condenser, and coolant filled inside a closed coolant circulation loop formed by the evaporator, the condenser, the coolant output pipe and the coolant return pipe. When the evaporator body absorbs heat, the coolant inside the evaporator body is converted into a gaseous state by the heat and then quickly dissipates the heat absorbed thereby through the heat-dissipating fins for a part of the gaseous coolant to be condensed to resume heat absorption and for the remaining part to flow to the condenser through the coolant output pipe to be condensed to a liquid state and return to the evaporator body along the coolant return pipe for heat absorption.Type: GrantFiled: October 24, 2017Date of Patent: April 16, 2019Assignee: Man Zai Industrial Co., Ltd.Inventors: Cheng-Feng Wan, Cheng-Chien Wan, Hao-Hui Lin
-
Patent number: 9797659Abstract: A refrigerant heat dissipation apparatus has an evaporator, a condenser having a first condensing tube and a second condensing tube, a first refrigerant tube, two second refrigerant tubes, and a refrigerant. The first refrigerant tube is connected between the top of the evaporator and an upper part of a first condensing tube. The second refrigerant tubes are respectively connected with a lower part of the first condensing tube and a lower part of the second condensing tube, so as to form a multi-flow closed-loop cycle. The refrigerant is filled into the multi-flow closed-loop cycle. The controlling of cycling direction of the refrigerant achieves the efficiency in heat dissipating of the refrigerant heat dissipation apparatus.Type: GrantFiled: May 18, 2016Date of Patent: October 24, 2017Assignee: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien Wan, Cheng-Feng Wan, Hao-Hui Lin
-
Publication number: 20160341488Abstract: A refrigerant heat dissipation apparatus has an evaporator, a condenser having a first condensing tube and a second condensing tube, a first refrigerant tube, two second refrigerant tubes, and a refrigerant. The first refrigerant tube is connected between the top of the evaporator and an upper part of a first condensing tube. The second refrigerant tubes are respectively connected with a lower part of the first condensing tube and a lower part of the second condensing tube, so as to form a multi-flow closed-loop cycle. The refrigerant is filled into the multi-flow closed-loop cycle. The controlling of cycling direction of the refrigerant achieves the efficiency in heat dissipating of the refrigerant heat dissipation apparatus.Type: ApplicationFiled: May 18, 2016Publication date: November 24, 2016Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien WAN, Cheng-Feng WAN, Hao-Hui LIN
-
Publication number: 20160223230Abstract: An evaporator with heat dissipating fins and a refrigerant heat dissipating apparatus using the same are provided herein and the refrigerant heat dissipating apparatus comprises the evaporator, a condenser, two refrigerant tubes connected between the evaporator and the condenser and a refrigerant filled into the evaporator body. When the evaporator body absorbs heat, the refrigerant absorbs heat and is converted to the gaseous state. The refrigerant in the gaseous state flows upward and conducts heat to a top of the evaporator body. The heat dissipating fins conduct heat quickly to condense most of the refrigerant in the gaseous state back to the liquid state to absorb heat again. The rest of the refrigerant in the gaseous state passes through the condenser via the first refrigerant tube to be the liquid refrigerant. The liquid refrigerant flows back to the evaporator body via the second refrigerant tube to absorb heat again.Type: ApplicationFiled: February 1, 2016Publication date: August 4, 2016Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Chien WAN, Cheng-Feng WAN, Hao-Hui LIN
-
Patent number: 8147109Abstract: A heat dissipation device of a vehicle lamp and an interposing element thereof are provided. The heat dissipation device is installed in a lamp room which is divided by the interposing element into a front partition and a rear partition. A heat sink is installed in the interposing elements. An air feeding fan is disposed in an air feeding channel of the interposing element, for drawing air in the front partition to the rear partition through the air feeding channel. Further, a back flow fan is disposed in the rear partition, for drawing air in the rear partition to the front partition through a back flow channel. Whereby, the air in the front partition is cooled down through an external air flow passing through the lamp cover. Then, the heat sink dissipates heat of the air flow with the relatively low temperature in the front partition to the rear partition.Type: GrantFiled: November 23, 2009Date of Patent: April 3, 2012Assignee: Man Zai Industrial Co., Ltd.Inventors: Cheng-Feng Wan, Hao-Hui Lin, Su-Chen Hu, Chen-Jung Chen, Hui-Fen Huang
-
Publication number: 20110226456Abstract: A heat dissipation device has an inlet pipeline, an outlet pipeline, at least one heat-dissipating unit and at least one actuator. Each of the at least one heat-dissipating unit is connected to the inlet pipeline and the outlet pipeline and includes multiple heat-dissipating elements being connected to each other. The at least one actuator is mounted on the inlet pipeline. The heat dissipation device is mounted around a large-sized electronic appliance to absorb and dissipate the heat generated by the large-sized electronic appliance so as to effectively reduce the working temperature of the electronic appliance to normal level. Therefore, the large-sized electronic appliance can work safely and is power-saving and environmental friendly.Type: ApplicationFiled: September 30, 2010Publication date: September 22, 2011Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Feng Wan, Hao-Hui Lin, Su-Chen Hu
-
Publication number: 20100315830Abstract: A heat dissipation device of a vehicle lamp and an interposing element thereof are provided. The heat dissipation device is installed in a lamp room which is divided by the interposing element into a front partition and a rear partition. A heat sink is installed in the interposing elements. An air feeding fan is disposed in an air feeding channel of the interposing element, for drawing air in the front partition to the rear partition through the air feeding channel. Further, a back flow fan is disposed in the rear partition, for drawing air in the rear partition to the front partition through a back flow channel. Whereby, the air in the front partition is cooled down through an external air flow passing through the lamp cover. Then, the heat sink dissipates heat of the air flow with the relatively low temperature in the front partition to the rear partition.Type: ApplicationFiled: November 23, 2009Publication date: December 16, 2010Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Feng Wan, Hao-Hui Lin, Su-Chen Hu, Chen-Jung Chen, Hui-Fen Huang
-
Patent number: 7762316Abstract: A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.Type: GrantFiled: August 6, 2007Date of Patent: July 27, 2010Assignee: Man Zai Industrial Co., Ltd.Inventors: Hao-Hui Lin, Su-Chen Hu
-
Patent number: 7762696Abstract: A vehicle lamp has a lamp holder, an LED array, an interior heat sink and a heat exchanger. The lamp holder is hollow and has a heat conductive portion. The LED array is mounted in the lamp holder. The interior heat sink is mounted on the LED array and has an inner conductor attached between the LED array and the heat conductive portion. The heat exchanger is mounted on an outer side of the heat conductive portion. Therefore, the vehicle lamp can efficiently dissipate heat generated by the LED array by the interior heat sink and the heat exchanger with little or no dust entering the lamp holder and accumulating on the LED array for improved lifespan and constant heat dissipating performance.Type: GrantFiled: November 17, 2008Date of Patent: July 27, 2010Assignee: Man Zai Industrial Co., Ltd.Inventors: Cheng-Feng Wan, Hao-Hui Lin, Su-Chen Hu
-
Publication number: 20090205808Abstract: A liquid cooling device for multiple electronic components has two liquid blocks, a heat-dissipating plate, a pump and a heat sink. The two liquid blocks and the heat sink are connected and communicated with other via tubing. The pump operates to make a coolant circulate among the two liquid blocks and the heat sink. The heat-dissipating plate is integrally formed with one liquid block. The heat-dissipating plate is disposed on another separate electronic component for absorbing heat. Therefore, the liquid cooling device has only two liquid blocks, but can dissipate heat generated by three electronic components.Type: ApplicationFiled: February 19, 2008Publication date: August 20, 2009Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Feng WAN, Hao-Hui Lin, Su-Chen Hu
-
Publication number: 20090205809Abstract: A liquid cooling device has a main liquid block, a pump, a heat sink, and at least one auxiliary liquid block that are in fluid communications. The auxiliary liquid block has a body and a partition that separates the body into a reservoir and a heat-absorbing chamber. The reservoir and the heat-absorbing chamber communicate with and other via a through hole on the partition. Since the heat-absorbing chamber is mounted to be adjacent to an electronic component that generates heat, the fluid in the heat-absorbing chamber absorbs the heat. When the fluid in the heat-absorbing chamber vaporizes and decreases the fluid in the reservoir has a higher level and thus flows to the heat-absorbing chamber via the through hole. Therefore, the heat-dissipating ability of the liquid cooling device is increased.Type: ApplicationFiled: February 19, 2008Publication date: August 20, 2009Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Cheng-Feng Wan, Hao-Hui Lin, Su-Chen Hu
-
Publication number: 20090040723Abstract: A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.Type: ApplicationFiled: August 6, 2007Publication date: February 12, 2009Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Hao-Hui Lin, Su-Chen Hu
-
Publication number: 20080302508Abstract: A heat-dissipating device includes a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall, and a surrounding wall that interconnects the planar plate and the base wall, that cooperates with the planar plate and the base wall to define an inner space thereamong, and that defines an inlet. The finned structure includes a plurality of partitioning plates that form a continuous meandering fluid path, and a plurality of heat-dissipating fins that are disposed in the meandering fluid path. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover.Type: ApplicationFiled: August 20, 2007Publication date: December 11, 2008Applicant: MAN ZAI INDUSTRIAL CO., LTD.Inventors: Hao-Hui Lin, Su-Chen Hu