Abstract: A method and apparatus for chemical mechanical polishing a semiconductor wafer by providing a novel high pressure mixture of gas and liquid in a pulsation mode for eliminating residual slurry, by-products, and slurry abrasive particles on or in the polishing pad.

Abstract: A fluid separation system applicable to gas chromatography includes a separating column in the form of a coiled tube in a thermally insulated enclosure. The ends of the coiled tube are connected by snap-action couplings to the outlet of an injector and the inlet of a detector which generates an electrical signal corresponding to the component of the fluid being separated. Snap action couplings also connect the thermally insulated enclosure to a thermal control system which circulates a heat exchange fluid to define the temperature in the enclosure.