Abstract: A method for welding metallic foils includes the method steps of: forming a parallel joint with a plurality of metallic foils to be joined, by arranging the foils in such a way that they contact each other over a wide area, and welding the metallic foils together by directing a laser beam onto an end face of the parallel joint of the foils, such that a welded seam joining the foils is formed.

Abstract: A filling head for filling an electrochemical cell with electrolyte has a pre-chamber and a filling chamber, as well as a shutoff element which is movable between an open position and a closed position and releases an opening between the pre-chamber and the filling chamber in the open position and closes off the opening in the closed position. The filling chamber has a pressure port. The shutoff element is movable against a restoring force from the closed position into the open position.

Abstract: A positioning unit includes two control carriages and a work carriage, it being possible to move the two control carriages and the work carriage on tracks that extend in parallel with one another. There is a working arm being articulated on a work base point on the work carriage and a control arm being articulated on a control base point on each of the control carriages. The control arms are articulated on the working arm at a control point of the working arm, the control point being spaced apart at a predefined lambda distance (d) from an end of the working arm that forms a working-point end and faces away from the work base point, and the two control base points and the work base point defining a triangle. At least two carriages of the two control carriages and the work carriage are movably arranged on a shared guide.

Abstract: A pressing system for a laser joining system for pressing together parts to be joined (storage cell, base plate) in the area of a joining point, includes a receptacle for accommodating the parts to be joined, a pressing element for locally pressing together the parts to be joined, in the area of the joining point, and a positioning system for the relative positioning of the pressing element and the receptacle and for pressing together the parts to be joined, during the joining process. The positioning system includes a parallel positioning device for the relative positioning of the receptacle and the pressing element in parallel to a plane (E), and an oblique positioning device for the relative positioning of the pressing element and the receptacle obliquely, in particular transversely, with respect to the plane (E) and for pressing together the parts to be joined, during the joining process.

Abstract: A method for joining a first join part, in particular a cover glass, with a second join part, in particular a housing and/or a display layer of a cover glass display assembly, uses a thermosensitive adhesive that is heated indirectly and/or directly by irradiation with light from a light source, in particular with infrared light and/or visible light, for producing the connection. A planar emitter is used as the light source. The method allows for a fast and secure joining of the join parts.

Abstract: A joining punch for a joining device for producing a joining connection, in particular an adhesive connection, between a first joining part, for example a cover glass, and a second joining part, for example a housing, has at least one force-receiving part to which a contact force can be applied and having at least two pressing parts for applying pressure to the first joining part. The at least two pressing parts are arranged and/or formed independently of one another on the joining punch in such a manner that they are tiltable relative to the force-receiving part. The joining punch is embodied in a joining device. The two joining parts can be pressed together according to a nominal distribution of the forces or pressures, in particular uniformly using the joining device. Unevennesses and deformations of the joining parts, in particular of the first joining part, can be compensated.

Abstract: A positioning unit includes two control carriages and a work carriage, it being possible to move the two control carriages and the work carriage on tracks that extend in parallel with one another. There is a working arm being articulated on a work base point on the work carriage and a control arm being articulated on a control base point on each of the control carriages. The control arms are articulated on the working arm at a control point of the working arm, the control point being spaced apart at a predefined lambda distance (d) from an end of the working arm that forms a working-point end and faces away from the work base point, and the two control base points and the work base point defining a triangle. At least two carriages of the two control carriages and the work carriage are movably arranged on a shared guide.

Abstract: A pressing system for a laser joining system for pressing together parts to be joined (storage cell, base plate) in the area of a joining point, includes a receptacle for accommodating the parts to be joined, a pressing element for locally pressing together the parts to be joined, in the area of the joining point, and a positioning system for the relative positioning of the pressing element and the receptacle and for pressing together the parts to be joined, during the joining process. The positioning system includes a parallel positioning device for the relative positioning of the receptacle and the pressing element in parallel to a plane (E), and an oblique positioning device for the relative positioning of the pressing element and the receptacle obliquely, in particular transversely, with respect to the plane (E) and for pressing together the parts to be joined, during the joining process.

Abstract: A transporting apparatus for simultaneously transporting at least two substrates into a substrate-treatment apparatus to be treated in a vacuum-treatment apparatus has at least two carrier apparatuses mounted for rotation in relation to a common axis and offset axially in relation to one another. At least one retaining frame configured for supporting at least one substrate is arranged on each of the two carrier apparatuses. Each retaining frame is configured to be shifted, by rotary movement of the two carrier apparatuses about the common axis, into mutually opposite regions of a treatment unit with the two carrier apparatuses spaced apart axially from one another sufficiently such that the treatment unit is arranged between the two carrier apparatuses.

Abstract: Disclosed is a method for removing individual layers of a layer stack. The layer stack includes a semiconductor layer disposed onto an optically dense electrically conductive layer which in turn is disposed upon an optically transparent layer. A laser at a first power level is projected through the optically transparent layer and onto the optically dense electrically conductive layer. The semiconductor layer is removed through heat evaporation imparted by the laser at the first power level without removing the optically dense electrically conductive layer. Optionally, the laser at a second power level, which is greater than the first power level, is projected onto the optically dense electrically conductive layer through the optically transparent layer. The optically dense electrically conductive layer is removed through heat evaporation imparted by the laser at the second power level without removing the optically transparent layer.