Abstract: A heat removal system for integrated circuit chips, lasers, portable electronic devices, and the like which produce destructive amounts of heat employs a device which delivers working fluid to a high heat flux surface in a manner to avoid any change in phase of the fluid. The invention is based on the recognition that the heat flux produced by such sources is so high that prior art heat sinks fail to remove heat at a sufficient rate from a high heat flux surface and become inefficient in removing heat. The fluid here is maintained at a pressure and pumped at a rate to provide a sufficiently short dwell time to maintain the fluid in a supracritical state thus avoiding vapor lock. The fluid also may be cooled by, for example, either an evaporative or an absorption chiller driven by the heat from the heat source or by a thermoelectric cooler.

Abstract: A heat removal system for integrated circuit chips, lasers, portable electronic devices, and the like which produce destructive amounts of heat employs a device which delivers working fluid to a high heat flux surface in a manner to avoid any change in phase of the fluid. The invention is based on the recognition that the heat flux produced by such sources is so high that prior art heat sinks fail to remove heat at a sufficient rate from a high heat flux surface and become inefficient in removing heat. The fluid here is maintained at a pressure and pumped at a rate to provide a sufficiently short dwell time to maintain the fluid in a supracritical state thus avoiding vapor lock. The fluid also may be cooled by, for example, either an evaporative or an absorption chiller driven by the heat from the heat source or by a thermoelectric cooler.