Abstract: An interface between an integrated circuit package and a heat sink comprises a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer impregnated in a liquid-permeable mounting mesh sheet sandwiched between two pressure-sensitive adhesive frames also impregnating the sheet surrounding the wafer location. The adhesive impregnated sheet frame prevents bleeding of the phase change material out of the space between the integrated circuit package and the heat sink. Methods of making the interface are described.