Patents Assigned to Marion Composites, A Div. of Technical Products Group, Inc.
  • Patent number: 5713178
    Abstract: Electromagnetic interference across a structural panel is minimized in a construction wherein a metal skin (24) is bonded to a metal frame (22) by an adhesive (40) by providing a series of peaks (36) and valleys (38) at the area of the intended joint between the skin (24) and the frame (22). The peaks (36) penetrate through the adhesive (40) to establish substantial electrical contact between the skin (24) and the frame (22) to provide shielding against electromagnetic interference while the adhesive (40) bonds the two together to provide a structurally sound panel.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: February 3, 1998
    Assignee: Marion Composites, A Div. of Technical Products Group, Inc.
    Inventors: W. Jeffrey Sturgill, Paul Case, Donald Stanulis, Robert S. Maule, Richard A. Bamberg