Abstract: The object is to provide an actuator that moves in a shearing direction. An actuator comprises an internal actuator including a first stator and a first mover opposed to the first stator, the first mover moving in a direction away from the first stator; a second stator having a fixation wall that is disposed in a direction in which the first stator and the first mover are opposed to each other and that is disposed along a first mover side and away from the first mover, the second stator being fixed with the first stator; and a second mover having a pressing wall inserted between the first mover and the fixation wall.

Abstract: The object is to provide an actuator that consumes less power. An actuator comprises: a stator that rotatably supports a plurality of stator rollers; a mover that rotatably supports a mover roller disposed between the stator rollers; and a wire made of a shape memory alloy that is disposed between the stator rollers and the mover roller and has both ends connected to respective two stator terminals provided in the stator.

Abstract: The object is to provide a tactile sense provision apparatus that vibrates the finger or the like of the user through a touch panel to provide the user with a tactile sense when the touch panel is operated. A tactile sense provision apparatus comprises a transparent plate that covers a touch panel of equipment; an actuator that is fixed to the transparent plate; a reception unit that receives a signal transmitted based on operation through the touch panel; and a control unit that operates the actuator based on a signal received by the reception unit.

Abstract: This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through holes electrically conductive, coating the substrate with a photosensitive dry film, and developing and hardening the photosensitive dry film as a plating resist; and copper-plating the inside of the through holes and the opening periphery thereof. The manufacturing method further comprises the steps of coating the copper-plated area with a metal protective film, eliminating the photosensitive dry film; forming a circuit pattern; and conducting an overlaying treatment as a post-processing step.

Abstract: According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and the inside of the through-holes is made electrically conductive. Then, after one side of the substrate is coated with a photosensitive dry film having an outer masking layer attached thereto, a developing solution is caused to infiltrate into the through-bores from the other side to develop the photosensitive dry film as a plating resist. The photosensitive dry film is then exposed to be hardened. The outer masking layer is removed to copper-electroplate the inside of the through-holes and the like. Finally, the photosensitive dry film is removed to form a circuit pattern.

Abstract: In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80° C. to 100° C. Thereafter, an IC is mounted on the film substrate.

Abstract: This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through holes electrically conductive, coating the substrate with a photosensitive dry film, and developing and hardening the photosensitive dry film as a plating resist; and copper-plating the inside of the through holes and the opening periphery thereof. The manufacturing method further comprises the steps of coating the copper-plated area with a metal protective film, eliminating the photosensitive dry film; forming a circuit pattern; and conducting an overlaying treatment as a post-processing step.

Abstract: According to this manufacturing method, a copper foil is attached to both sides of an insulating material to form a substrate. First, a large number of through-holes is made in the substrate and the inside of the through-holes is made electrically conductive. Then, after one side of the substrate is coated with a photosensitive dry film having an outer masking layer attached thereto, a developing solution is caused to infiltrate into the through-bores from the other side to develop the photosensitive dry film as a plating resist. The photosensitive dry film is then exposed to be hardened. The outer masking layer is removed to copper-electroplate the inside of the through-holes and the like. Finally, the photosensitive dry film is removed to form a circuit pattern.