Patents Assigned to Maruya Seisakusho Co., Ltd.
  • Soldering method and solder joint member
    Patent number: 7176388
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Grant
    Filed: November 19, 2004
    Date of Patent: February 13, 2007
    Assignees: NEC Infrontia Corporation, NEC Toppan Circuit Solutions Toyama, Inc., Soldercoat Co., Ltd., Maruya Seisakusho Co. Ltd., Nihon Den-netsu Keiki Co., Ltd.
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka
  • Soldering method and solder joint member
    Patent number: 6902102
    Abstract: In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: June 7, 2005
    Assignees: NEC Infrontia Corporation, NEC Toppan Circuit Solutions Toyama, Inc., Soldercoast Co., Ltd., Maruya Seisakusho Co., Ltd., Nihon Den-netsu Keiki Co., Ltd.
    Inventors: Kazuhiko Tanabe, Hiroaki Terada, Masahiro Sugiura, Tetsuharu Mizutani, Keiichiro Imamura, Takashi Tanaka