Patents Assigned to Marvel World Trade Ltd.
  • Patent number: 9690425
    Abstract: System and methods are provided for tracking baseline signals for touch detection. The system includes: a comparison network configured to determine whether an input baseline signal is within a tracking range; a filter network configured to generate an output baseline signal for touch detection based at least in part on the input baseline signal according to one or more filter parameters; and a signal processing component configured to update the one or more filter parameters based at least in part on the determination of whether the input baseline signal is within the tracking range.
    Type: Grant
    Filed: February 23, 2015
    Date of Patent: June 27, 2017
    Assignee: MARVEL WORLD TRADE LTD.
    Inventors: Kanke Gao, Bike Xie, Songping Wu
  • Publication number: 20140198869
    Abstract: A method for communication includes configuring a communication system that includes a transmitter and a receiver with first precoding matrices for mapping up to N data streams onto N transmit antenna ports of the transmitter. Each of at least some of the first precoding matrices are derived from respective second and third precoding matrices. The second and third precoding matrices are configured for mapping data onto respective numbers of transmit antenna ports that are less than N. The data streams are mapped onto the N transmit antenna ports using a precoding scheme based on one of the first precoding matrices. The mapped data streams are transmitted over the N transmit antenna ports from the transmitter to the receiver.
    Type: Application
    Filed: March 17, 2014
    Publication date: July 17, 2014
    Applicant: Marvel World Trade Ltd.
    Inventors: Ezer Melzer, Yu-Ngok Li, Adoram Erell, Daniel Yellin
  • Patent number: 8385440
    Abstract: An apparatus includes a signal generator to output one of a first sequence or a second sequence and to augment sequences with cover codes, such that a sum of out-of-phase aperiodic autocorrelation coefficients of the first sequence and the second sequence of is zero, a physical layer preamble controller to control the signal generator to generate a preamble of a data unit, including a short training field (STF) formatter to cause the signal generator to generate an STF for use in at least frame synchronization, and a long training field (LTF) formatter to cause the signal generator to generate an LTF for use in at least channel estimation, such that the STF formatter controls the signal generator to include the first sequence in a last portion of the STF, and the LTF formatter controls the signal generator to include the second sequence in a beginning portion of the LTF.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: February 26, 2013
    Assignee: Marvel World Trade Ltd.
    Inventors: Hongyuan Zhang, Rohit U. Nabar, Songping Wu, Hui-Ling Lou
  • Publication number: 20130011964
    Abstract: A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 10, 2013
    Applicant: MARVEL WORLD TRADE LTD.
    Inventors: Chenglin Liu, Shiann-Ming Liou
  • Publication number: 20090269891
    Abstract: A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.
    Type: Application
    Filed: July 1, 2009
    Publication date: October 29, 2009
    Applicant: MARVEL WORLD TRADE LTD.
    Inventors: Chenglin Liu, Shiann-Ming Liou