Abstract: A method for depositing a layer of additional material onto an electrically conductive thin layer structure preferably by means of the thermally induced reason of a compound in the vapor state, in which the thin structure is heated by an electric current passed through it. The method is especially suitable for reinforcing metallic conductor structures which have been made on a substrate by a direct-writing-laser chemical vapor deposition method, for example, fine tungsten wires.
Type:
Grant
Filed:
July 20, 1990
Date of Patent:
November 17, 1992
Assignee:
Mas-Planck-Gesellschaft zur Foerderung der Wissenschaften e.V.