Abstract: A molded electrical circuit assembly is disclosed where the molded electrical circuit assembly comprises a device assembly overlaying at least a portion of a face applique and a backing assembly overlaying at least a portion of the device assembly. The device assembly is retained between the face applique and the backing assembly, and the backing assembly has a window formed proximate to the device assembly. Also included is a molded portion molded generally over the backing assembly and abutting at least a portion of the face applique.

Abstract: A method of producing a molded assembly for at least partially encapsulating a touch panel structure. The method includes providing a touch panel structure which has a front side, a reverse side and an edge extending therebetween. A circuit is attached to the panel structure and includes at least one device. The panel is positioned in a cavity of a plastic injection mold which includes a hollow shutoff positioned relative to the device on the touch panel. When the mold is closed, a rim portion of the hollow shutoff is positioned against the reverse side of the panel spaced away from the device so as to at least partially shield the portion of the panel containing the device from the injection molding environment. The present invention also envisions a product produced by this method.