Abstract: A high density connector for connecting multiple circuits between printed circuit boards or the like is formed of inter-engaging mating, first and second connector halves formed of an electrical insulating material with said connector halves including opposed connection faces having uniform width and height undulations forming alternating flattened peaks and valleys of limited width with the peaks and valleys having an electrically conductive coating thereon to form longitudinally spaced transversely offset contacts at the peaks and valleys. The connection faces of the respective connector halves bear mirror image undulations. The center to center distance between longitudinally adjacent contacts is less than the peak to valley distance between those contacts to increase the electrical creapage path between longitudinally adjacent contacts of the mating first and second connector halves.