Patents Assigned to Mat-Tech B.V.
  • Composition of a solder, and method of manufacturing a solder connection
    Patent number: 9943930
    Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: April 17, 2018
    Assignees: Koninklijke Philips N.V., Mat-Tech B.V.
    Inventors: Nicolaas Johannes Antonius Van Veen, Mohammad Hossain Biglari
  • Composition of a solder, and method of manufacturing a solder connection
    Patent number: 8298680
    Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
    Type: Grant
    Filed: May 11, 2005
    Date of Patent: October 30, 2012
    Assignees: Koninklijke Philips Electronics N.V., Mat-Tech B.V.
    Inventors: Nicolaas Johannes Anthonius Van Veen, Mohammad Hossain Biglari
  • COMPOSITION OF A SOLDER, AND METHOD OF MANUFACTURING A SOLDER CONNECTION
    Publication number: 20090162622
    Abstract: The solder composition comprises particles of a thermodynamically metastable alloy. One of the elements of the alloy will form an intermetallic compound with a metal surface. The solder composition is particularly suitable for use in bumping of semiconductor devices.
    Type: Application
    Filed: May 11, 2005
    Publication date: June 25, 2009
    Applicants: DUTCH POLYMER INSTITUTE, MAT-TECH B.V.
    Inventors: Nicolaas Johannes Anthonius Van Veen, Mohammad Hossain Biglari