Patents Assigned to Materials Modification, Inc.
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Publication number: 20030172772Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.Type: ApplicationFiled: March 11, 2003Publication date: September 18, 2003Applicant: Materials Modification, Inc.Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
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Publication number: 20020112794Abstract: The present invention relates to the production of ultrafine powders using a microwave plasma apparatus and chemical synthesis technique. Microwaves generated by a magnetron (1) are passed through waveguides (2) before they arrive at the head of a plasmatron (3). These high energy microwaves ionize a plasma gas, thus releasing large amounts of energy. The energy thus released is utilized to initiate and sustain chemical reactions between the desired elements being pumped in a spiral pattern into the plasmatron (3). The reaction products are quenched rapidly in a reactor column (4) into ultrafine powders.Type: ApplicationFiled: April 4, 2002Publication date: August 22, 2002Applicant: Materials Modification, Inc.Inventors: Krupashankara M. Sethuram, Raja Kalyanaraman
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Patent number: 6309591Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material.Type: GrantFiled: October 5, 1999Date of Patent: October 30, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6270718Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: October 5, 1999Date of Patent: August 7, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6187087Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: October 5, 1999Date of Patent: February 13, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6183690Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: October 5, 1999Date of Patent: February 6, 2001Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 6001304Abstract: A method of bonding a particle material to near theoretical density, includes placing a particle material in a die. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps, is applied. The method can be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material. The method may also be applied to perform combustion synthesis of a reactive material, followed by consolidation or joining to near-net shaped articles or parts.Type: GrantFiled: December 31, 1998Date of Patent: December 14, 1999Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 5989487Abstract: An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to 20,000 amps., is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a shear force of about 5-50 MPa is applied. In the second stage, an axial pressure of about less than 1 to 2,000 MPa is applied to the particle material for a predetermined time period, and substantially simultaneously therewith, a steady current of about 1 to 20,000 amps. is applied. The apparatus may be used to bond metallic, ceramic, intermetallic and composite materials to near-net shape, directly from precursors or elemental particle material without the need for synthesizing the material.Type: GrantFiled: March 23, 1999Date of Patent: November 23, 1999Assignee: Materials Modification, Inc.Inventors: Sang H. Yoo, Krupashankara M. Sethuram, Tirumalai S. Sudarshan
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Patent number: 5912399Abstract: A new tungsten compound is formed by reacting ammonium metatungstate with guanidine carbonate. Such a compound can be converted to metallic tungsten, tungsten carbide or oxycarbide, and tungsten nitride or oxynitride. One can also make multiphase composite particles based on molybdenum, tungsten or their compounds (such as carbide or nitride), and at least one other metallic phase, such as cobalt, copper, nickel, iron or silver. The process involves first dispersing particles of a refractory metal or its compounds in a liquid medium, followed by inducing a chemical reaction in the liquid phase to generate a new solid phase which coats or mixes with the dispersed particles. The solid phase includes elements required in the final composite. After removing the liquid phase, the remaining solid is converted by hydrogen reduction into the final products.Type: GrantFiled: November 14, 1996Date of Patent: June 15, 1999Assignee: Materials Modification Inc.Inventors: Chunzhe C. Yu, Reshma Kumar