Abstract: A method of joining workpieces using a solder alloy. The alloy contains either at least 1% or a maximum of about 10% by weight of an element or a mixture of elements selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, and tantalum; either at least 0.01% or 0.01–10% by weight of an element or a mixture of elements selected from the group of the lanthanides (rare earths); either at least 0.5% or 0.5–10% by weight of an element or a mixture of elements selected from the group consisting of silver, copper, and indium; optionally either at least 0.01% or 0.01–1% by weight of gallium; and a remainder consisting of tin, lead, or of a mixture of tin and lead.

Abstract: The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a solder braze alloy. The novel alloy is characterized in that it comprises 1-10% by weight of an element or a mixture of elements of subgroup IVa and/or Va of the Periodic Table of the Elements and 0.1-20 wt% of an element or a mixture of elements of the group of the rare earths and the remainder consists of zinc, lead, tin, bismuth or indium or a mixture predominantly of two or more of the elements zinc, lead, tin, bismuth and indium and optionally of the elements silver, copper, gallium, antimony, nickel, manganese, chromium, cobalt possibly of customary impurities.

Abstract: The invention, which enables wider use to be made of soft-soldering techniques, concerns an alloy, in particular a solder alloy, a method of joining workpieces by soldering using the solder alloy and the use of the alloy for soldering. The alloy proposed is characterized in that it contains at least 1% by wt. of an element or a mixture of elements from sub-group IVa and/or Va in the periodic table, at least 0.01% by wt. of an element or a mixture of elements from the lanthanide series; optionally at least 0.5% of silver or copper or indium or a mixture silver and/or copper and/or indium; and optionally at least 0.01% by wt. of gallium, the remainder consisting of tin or lead or a mixture of tin and lead plus, as applicable, the usual impurities. The alloy proposed can be used as solder in oxygen-containing atmospheres such as air, can be used at relatively low temperatures and efficiently wets normally difficult to wet surfaces such as ceramic surfaces.

Abstract: A process for joining workpieces by active soldering. The process includes cleaning the surfaces of the workpieces to be joined; heating the workpieces to be joined; placing an active, low-temperature solder material on at least one of the surfaces of the workpieces to be joined; mechanically activating the molten solder material, to break oxide films on the solder material, while the solder material contacts the surfaces of the workpieces to be joined; assembling the surfaces of the workpieces to be joined; and applying pressure to the surfaces of the workpieces to be joined both while the solder material is molten and as the solder material cools to a solid.