Abstract: A rotary sputtering target bonded to a backing tube such that the bonding material is applied only proximate the ends of the rotary sputtering target and is also between the target and the backing tube to form a gap between the rotary sputtering target and the backing tube and a device for bonding a rotary sputtering target to a backing tube.
Type:
Grant
Filed:
July 11, 2011
Date of Patent:
April 21, 2015
Assignee:
Materion Advanced Material Technologies and Services Inc.
Inventors:
George Michael Wityak, Luther Wilburn Cox
Abstract: A rotary deposition target bonded to a backing tube such that the bonding material is applied only at the ends of the rotary sputtering target to form a gap between the rotary sputtering target and the backing tube to enable a target cooling fluid used during the deposition process to contact the target directly and to provide a hermetic seal to contain the cooling fluid within the gap and prevent the fluid from being exposed to the environment within the deposition chamber.
Type:
Application
Filed:
February 1, 2013
Publication date:
August 1, 2013
Applicant:
Materion Advanced Materials Technologies and Services Inc.
Inventor:
Materion Advanced Materials Technologies and Services Inc.
Abstract: Disclosed in this specification is a lead-free soldering alloy made of gold, tin and indium. The tin is present in a concentration of 17.5% to 20.5%, the indium is present in a concentration of 2.0% to 6.0% and the balance is gold and the alloy has a melting point between 290° C. and 340° C. and preferably between 300° C. and 340° C. The soldering alloy is particularly useful for hermetically sealing semiconductor devices since the melting temperature is sufficiently high to permit post-seal heating and sufficiently low to allow sealing of the semiconductor without causing damage.
Type:
Grant
Filed:
June 18, 2009
Date of Patent:
October 23, 2012
Assignee:
Materion Advanced Materials Technologies and Services Inc.