Abstract: The present invention relates to a sputtering target consisting of an alloy consisting of Co, Zr, Ta and, optionally, one or more further element(s) X from the group of Mo, Pd, Ni, Ti, V, W, and B, characterized in that the target has a maximum magnetic permeability ?max of 60 or lower and/or characterized in that the target has a maximum pass through flux (PTF) variation (FMax?FMin)/FAverage of 0.2 or lower, preferably of 0.15 or lower, and most preferably of 0.10 or lower.

Abstract: The present invention relates to a sputtering target comprising Ni, W and, optionally, one or more further metal(s) X selected from the group of the refractory metals, Sn, Al and Si, which has a normalized peak intensity ratio PIR=INi/IW·(AW+Ax)/ANi of 0.40 or greater, wherein INi is the intensity of the (111) peak of Ni, IW is the intensity of the (110) peak of W, Aw is the fraction of W in the target in atom %, Ax is the total fraction of the one or more further metals selected from the group of the refractory metals, Sn, Al and Si in the target in atom %, ANi is the fraction of Ni in the target in atom %, and wherein the intensities of the peaks are determined by X-ray powder diffraction using Cu-Kalpha radiation.

Abstract: The present invention relates to a sputtering target, comprising a silver alloy comprising a first element, selected from indium, tin, antimony and bismuth, in an amount of 0.01 to 2 wt. %, based on the total weight of the silver alloy, and 0.01 to 2 wt. % titanium, based on the total weight of the silver alloy, and having an average grain size of no more than 55 ?m.

Abstract: The present invention relates to a sputtering target comprising Ni, W and, optionally, one or more further metal(s) X selected from the group of the refractory metals, Sn, Al and Si, which has a normalized peak intensity ratio PIR=INi/Iw·(Aw+Ax)/ANI of 0.40 or greater, wherein INi is the intensity of the (111) peak of Ni, Iw is the intensity of the (110) peak of W, Aw is the fraction of W in the target in atom %, Ax is the total fraction of the one or more further metals selected from the group of the refractory metals, Sn, Al and Si in the target in atom %, ANi is the fraction of Ni in the target in atom %, and wherein the intensities of the peaks are determined by X-ray powder diffraction using Cu-Kalpha radiation.

Abstract: The present invention relates to a process for preparing a tubular article, comprising (a) providing a carrier tube, (b) providing a metal coating on the carrier tube by applying a liquid metal phase onto the carrier tube and solidifying the liquid metal phase, (c) applying a contact pressure to the metal coating by at least one densification tool, and moving the densification tool and the metal coating relative to each other.

Abstract: A double-layer system includes a metal layer facing away from a viewer and a coating facing the viewer. In order to make the layer system production process as simple as possible and to provide a sputter deposition method that dispenses entirely with the use of reactive gases in the sputtering atmosphere or requires only a small amount thereof, the coating is in the form of an optically partially absorbing layer which has an absorption coefficient kappa of less than 0.7 at a wavelength of 550 nm and a thickness ranging from 30 to 55 nm.

Abstract: A sputtering target for the production of layers such as optical layers, the layers produced by the target, and a method for producing the target are described. In addition to Si or a combination of Si and Al, the sputtering target contains metal oxide(s), a combination of at least two metal oxides, or a combination containing at least one metal oxide in the form of an alloy or in the form of a mixture. The sputtering target has a metal oxide fraction generated by the Si and Al and the metal oxide(s) or the combination thereof. Preferably, the metal oxide in the sputtering target is a metal oxide selected from ZrO2, Ta2O5, Y2O3, HfO, CaO, MgO, Ce2O3, Al2O3, TiO2 and Nb2O5.

Abstract: The present invention relates to a sputtering target, which comprises a zirconium oxide as a sputtering material, wherein the zirconium oxide has an oxygen deficiency, compared to the oxygen content of its fully oxidized form, of at least 0.40 wt %, has a total amount of metal elements other than zirconium of less than 3.0 wt %, based on the total amounts of metal elements including zirconium, and has an X-ray powder diffraction pattern having a peak P1 at 28.2°+/?0.2° 2-theta, a peak P2 at 31.4°+/?0.2° 2-theta, and a peak P3 at 30.2°+/?0.2° 2-theta.

Abstract: The invention relates to a sputtering target containing a sputtering material containing a metal oxide. The sputtering material contains zirconium and titanium as metals and contains at least one mixed oxide phase.