Patents Assigned to MATERION NEWTON INC.
  • Diffusion barriers for metallic superconducting wires
    Patent number: 11791066
    Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: October 17, 2023
    Assignee: Materion Newton Inc.
    Inventors: David B. Smathers, Paul Aimone
  • Tantalum based alloy that is resistant to aqueous corrosion
    Patent number: 11713495
    Abstract: A tantalum or tantalum alloy which contains pure or substantially pure tantalum and at least one metal element selected from the group consisting of Ru, Rh, Pd, Os, Ir, Pt, Mo, W and Re to form a tantalum alloy that is resistant to aqueous corrosion. The invention also relates to the process of preparing the tantalum alloy.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: August 1, 2023
    Assignee: Materion Newton Inc.
    Inventors: Paul R. Aimone, Evan Hinshaw
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 11640222
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: May 2, 2023
    Assignee: Materion Newton, Inc.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • Niobium-based alloy that is resistant to aqueous corrosion
    Patent number: 11629393
    Abstract: In various embodiments, a metal alloy resistant to aqueous corrosion consists essentially of or consists of niobium with additions of tungsten, molybdenum, and one or both of ruthenium and palladium.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: April 18, 2023
    Assignee: Materion Newton, Inc.
    Inventors: Paul Aimone, Mei Yang
  • Electronic devices having bilayer capping layers and/or barrier layers
    Patent number: 11599210
    Abstract: In various embodiments, electronic devices such as thin-film transistors and/or touch-panel displays incorporate bilayer capping layers and/or barrier layers.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: March 7, 2023
    Assignee: Materion Newton, Inc.
    Inventors: Helia Jalili, Francois Dary, Barbara Cox
  • Diffusion barriers for metallic superconducting wires
    Patent number: 11574749
    Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.
    Type: Grant
    Filed: August 11, 2021
    Date of Patent: February 7, 2023
    Assignee: Materion Newton Inc.
    Inventors: David B. Smathers, Paul R. Aimone
  • Diffusion barriers for metallic superconducting wires
    Patent number: 11495372
    Abstract: In various embodiments, superconducting wires incorporate diffusion barriers composed of Nb alloys or Nb—Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 8, 2022
    Assignee: Materion Newton Inc.
    Inventors: David B. Smathers, Paul Aimone
  • Refractory metal plates
    Patent number: 11443929
    Abstract: A refractory metal plate is provided. The plate has a center, a thickness, an edge, a top surface and a bottom surface, and has a crystallographic texture (as characterized by through thickness gradient, banding severity; and variation across the plate, for each of the texture components 100//ND and 111//ND, which is substantially uniform throughout the plate.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: September 13, 2022
    Assignee: Materion Newton, Inc.
    Inventors: Peter R. Jepson, Dincer Bozkaya
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 11392257
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 19, 2022
    Assignee: MATERION NEWTON INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang