Patents Assigned to Matrics, Inc.
  • Patent number: 6915551
    Abstract: A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: July 12, 2005
    Assignee: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20050027604
    Abstract: A system and method for conducting an inventory of tags, wherein each tag is assigned a Tag ID and a manufacturer number. Each tag can be attached to an item to take inventory of those items. A tag reader transmits a wake-up signal followed by at least one clock signal. Each tag increments a first tag count in response to the clock signals, and transmits the Tag ID assigned to the tag when the first tag count corresponds to the Tag ID assigned to the tag. The tag reader records the transmitted Tag IDs. When more than one tag transmits simultaneously, the tag stores the Tag ID in order to resolve the contention when the first read cycle is complete. In the second read cycle, the tag reader transmits the contended Tag ID followed by at least one clock signal.
    Type: Application
    Filed: September 2, 2004
    Publication date: February 3, 2005
    Applicant: Matrics, Inc.
    Inventors: William Bandy, Michael Arneson, Robert Williams
  • Patent number: 6848162
    Abstract: A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface. The first surface and second surface are moved apart. The plurality of dies remain attached to the second surface.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: February 1, 2005
    Assignee: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040250949
    Abstract: Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 16, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040251541
    Abstract: Methods, systems, and apparatuses for forming a radio frequency identifiable disc medium storage device are described. A metal layer is deposited onto a disc. At least one metal trace on the disc is connected to the metal layer. An adhesive interposer is attached to the disc around an opening in the center of the disc. The interposer includes an integrated circuit die. Pads of the integrated circuit die are coupled to the at least one pair of metal traces by the interposer. The interposer further includes a matching network. A coating is formed on the disc to encapsulate the metal layer, interposer, and integrated circuit die.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 16, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040207527
    Abstract: An identification (ID) tag includes a substrate having an input capable of receiving a high frequency signal. For instance, the high frequency signal can be a radio frequency (RF) signal that is generated as part of a radio frequency (RF) ID system. A first charge pump is coupled to the input and is configured to convert the high frequency signal to a substantially direct current (DC) voltage. A data recovery circuit is coupled to the input and is capable of recovering data from the high frequency signal. A back scatter switch is coupled to the input and is capable of modifying an impedance of the input, responsive to a control signal. A state machine is disposed on the substrate and is responsive to the data recovered by the second charge pump, where the state machine is capable of generating the control signal for the back scatter switch in response to the data.
    Type: Application
    Filed: May 7, 2004
    Publication date: October 21, 2004
    Applicant: Matrics, Inc.
    Inventors: Wayne E. Shanks, William R. Bandy, Michael R. Arneson, Kevin J. Powell
  • Patent number: 6784813
    Abstract: A method, system, and apparatus for remotely calibrating data symbols received by a radio frequency identification (RFID) tag population are described. Tags are interrogated by a reader, which may be located in a network of readers. The reader transmits data symbols to the tags. Tags respond to the interrogations with symbols that each represent one or more bits of data. To calibrate the tags, the reader transmits a plurality of pulses of different lengths to the tag population. The tags receive the plurality of pulses. A characteristic of each pulse, such as a pulse length, is stored by the tags. The stored pulse lengths are used to define different data symbols that are subsequently received by the tags from the reader.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: August 31, 2004
    Assignee: Matrics, Inc.
    Inventors: Wayne E. Shanks, William R. Bandy, Kevin J. Powell, Michael R. Arneson
  • Publication number: 20040111338
    Abstract: A system and method for conducting an inventory of tags, wherein each tag is assigned a Tag ID and a manufacturer number. Each tag can be attached to an item to take inventory of those items. A tag reader transmits a wake-up signal followed by at least one clock signal. Each tag increments a first tag count in response to the clock signals, and transmits the Tag ID assigned to the tag when the first tag count corresponds to the Tag ID assigned to the tag. The tag reader records the transmitted Tag IDs. When more than one tag transmits simultaneously, the tag stores the Tag ID in order to resolve the contention when the first read cycle is complete. In the second read cycle, the tag reader transmits the contended Tag ID followed by at least one clock signal.
    Type: Application
    Filed: December 2, 2003
    Publication date: June 10, 2004
    Applicant: Matrics, Inc.
    Inventors: William R. Bandy, Michael R. Arneson, Robert A. Williams
  • Patent number: 6734797
    Abstract: An identification (ID) tag includes a substrate having an input capable of receiving a high frequency signal. For instance, the high frequency signal can be a radio frequency (RF) signal that is generated as part of a radio frequency (RF) ID system. A first charge pump is coupled to the input and is configured to convert the high frequency signal to a substantially direct current (DC) voltage. A data recovery circuit is coupled to the input and is capable of recovering data from the high frequency signal. A back scatter switch is coupled to the input and is capable of modifying an impedance of the input, responsive to a control signal. A state machine is disposed on the substrate and is responsive to the data recovered by the second charge pump, where the state machine is capable of generating the control signal for the back scatter switch in response to the data.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: May 11, 2004
    Assignee: Matrics, Inc.
    Inventors: Wayne E. Shanks, William R. Bandy, Michael R. Arneson, Kevin J. Powell
  • Publication number: 20040020036
    Abstract: An RFID tag that includes a die having one or more connecting pads is assembled. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.
    Type: Application
    Filed: December 19, 2002
    Publication date: February 5, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040020038
    Abstract: A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. The second surface is positioned to be closely adjacent to the first surface that has a plurality of dies attached thereto. A distance is reduced between the first surface and the second surface until the plurality of dies contact the second surface and attach to the second surface due to an adhesiveness of the second surface. The first surface and second surface are moved apart. The plurality of dies remain attached to the second surface.
    Type: Application
    Filed: December 19, 2002
    Publication date: February 5, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040020039
    Abstract: A method and system for transferring a plurality of integrated circuit dies from a first surface to a second surface is described. Each hollow barrel of a plurality of hollow barrels is applied to a respective die residing on the first surface. The respective die is caused to move into each hollow barrel in parallel. These steps are repeated until each hollow barrel contains a stack of dies of a predetermined number. A die from each hollow barrel is deposited onto the second surface until the stack of dies contained by each hollow barrel is substantially depleted.
    Type: Application
    Filed: December 19, 2002
    Publication date: February 5, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040020037
    Abstract: A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. A ring shaped groove is formed in a first surface of a wafer around a plurality of dies. The wafer is scribed to form a grid of grooves in the first surface of the wafer that separates the plurality of dies. A solidifiable material is applied to the first surface of the wafer to substantially fill the ring shaped groove and the grooves of the grid. The solidifiable material is caused to harden into a ring shaped hardened material in the ring shaped groove and into a grid shaped hardened material in the grooves of the grid. The wafer is thinned so that the grid shaped hardened material removably holds the plurality of dies.
    Type: Application
    Filed: December 19, 2002
    Publication date: February 5, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20040020040
    Abstract: A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. In one aspect for making a die frame, a wafer that comprises a plurality of dies is attached to a surface of a tape structure. A grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure. A portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure. The grid shaped structure removably holds the plurality of dies. One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface. In an alternative aspect, when the grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure, the surface of the tape structure is breached in the grooves.
    Type: Application
    Filed: May 6, 2003
    Publication date: February 5, 2004
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20030214389
    Abstract: A method and system for optimizing an interrogation of a tag population that includes a plurality of tags, wherein each of the plurality of tags is assigned a tag address includes determining a tag population size; selecting one of a plurality of efficiency profiles that matches the determined tag population size; and defining a plurality of interrogation read cycles according to the selected efficiency profile.
    Type: Application
    Filed: April 1, 2003
    Publication date: November 20, 2003
    Applicant: Matrics, Inc.
    Inventors: Michael R. Arneson, William R. Bandy
  • Publication number: 20030146783
    Abstract: A charge pump is configured to convert a high frequency signal to a substantially direct current (DC) voltage. The charge pump includes an input capable of receiving the high frequency signal, and a plurality of stages parallel connected to the charge pump input. Charge from the high frequency signal is accumulated in the plurality of stages during a first half cycle of the high frequency signal, and is passed from a nth stage of the plurality of stages to a (n+1)th stage of the plurality of stages during a second half cycle of said high frequency signal, the (n+1)th stage being closer to the charge pump output than the nth stage. The accumulated charge increases as it moves through the plurality of stages to the charge pump output to produce a DC output voltage that is sufficiently stable to be utilized as a power supply. In embodiments of the invention, the charge pump is configured on a radio frequency (RF) identification (ID) tag, and the DC voltage provides the power supply for the RF ID tag.
    Type: Application
    Filed: March 10, 2003
    Publication date: August 7, 2003
    Applicant: Matrics, Inc.
    Inventors: William R. Bandy, Wayne E. Shanks
  • Patent number: 6549064
    Abstract: A charge pump is configured to convert a high frequency signal to a substantially direct current (DC) voltage. The charge pump includes an input capable of receiving the high frequency signal, and a plurality of stages parallel connected to the charge pump input. Charge from the high frequency signal is accumulated in the plurality of stages during a first half cycle of the high frequency signal, and is passed from a nth stage of the plurality of stages to a (n+1)th stage of the plurality of stages during a second half cycle of said high frequency signal, the (n+1)th stage being closer to the charge pump output than the nth stage. The accumulated charge increases as it moves through the plurality of stages to the charge pump output to produce a DC output voltage that is sufficiently stable to be utilized as a power supply. In embodiments of the invention, the charge pump is configured on a radio frequency (RF) identification (ID) tag, and the DC voltage provides the power supply for the RF ID tag.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: April 15, 2003
    Assignee: Matrics, Inc.
    Inventors: William R. Bandy, Wayne E. Shanks
  • Publication number: 20020167405
    Abstract: A radio frequency identification (RFID) architecture is described. RFID tags are interrogated by a reader, which may be located in a network of readers. The reader transmits symbols to the tags. Tags respond to the interrogations with symbols that each represent one or more bits of data. An RFID tag includes an antenna pad, a receiver, a state machine, and a modulator. The receiver is coupled to the antenna pad. The receiver receives a symbol from the antenna pad and outputs a received signal. The state machine is configured to determine a response symbol from the received signal and an operating state of the tag. The modulator is coupled to the antenna pad. The modulator is configured to backscatter modulate the received symbol with the response symbol. The modulator is configured to output the backscatter modulated symbol to the antenna pad.
    Type: Application
    Filed: February 12, 2002
    Publication date: November 14, 2002
    Applicant: Matrics, Inc.
    Inventors: Wayne E. Shanks, William R. Bandy, Michael R. Arneson, Kevin J. Powell
  • Publication number: 20020149416
    Abstract: A charge pump is configured to convert a high frequency signal to a substantially direct current (DC) voltage. The charge pump includes an input capable of receiving the high frequency signal, and a plurality of stages parallel connected to the charge pump input. Charge from the high frequency signal is accumulated in the plurality of stages during a first half cycle of the high frequency signal, and is passed from a nth stage of the plurality of stages to a (n+1)th stage of the plurality of stages during a second half cycle of said high frequency signal, the (n+1)th stage being closer to the charge pump output than the nth stage. The accumulated charge increases as it moves through the plurality of stages to the charge pump output to produce a DC output voltage that is sufficiently stable to be utilized as a power supply. In embodiments of the invention, the charge pump is configured on a radio frequency (RF) identification (ID) tag, and the DC voltage provides the power supply for the RF ID tag.
    Type: Application
    Filed: February 12, 2002
    Publication date: October 17, 2002
    Applicant: Matrics, Inc.
    Inventors: William R. Bandy, Wayne E. Shanks
  • Publication number: 20020149482
    Abstract: An identification (ID) tag includes a substrate having an input capable of receiving a high frequency signal. For instance, the high frequency signal can be a radio frequency (RF) signal that is generated as part of a radio frequency (RF) ID system. A first charge pump is coupled to the input and is configured to convert the high frequency signal to a substantially direct current (DC) voltage. A data recovery circuit is coupled to the input and is capable of recovering data from the high frequency signal. A back scatter switch is coupled to the input and is capable of modifying an impedance of the input, responsive to a control signal. A state machine is disposed on the substrate and is responsive to the data recovered by the second charge pump, where the state machine is capable of generating the control signal for the back scatter switch in response to the data.
    Type: Application
    Filed: February 12, 2002
    Publication date: October 17, 2002
    Applicant: Matrics, Inc.
    Inventors: Wayne E. Shanks, William R. Bandy, Michael R. Arneson, Kevin J. Powell