Abstract: The present invention relates to a semiconductor laser device on which a high-frequency signal can be superposed without radiating said high-frequency signal externally. Said device consists of a semiconductor laser element mounted directly or indirectly through a semiconductor substrate on a comb-frame, and an outer frame made of an insulation material provided at an area surrounding said comb-frame on which said semiconductor laser chip is mounted; and this device is fixed on a printed circuit board with a through-hole allowing a direct pass of laser light emitted from said semiconductor laser device. Said printed circuit board is provided with a high-frequency circuit and is lined with a metal film layer on the rear surface of said printed circuit board or within said printed circuit board.