Abstract: A drive apparatus of the present invention includes: a recording/reproduction section, a drive control section and a memory circuit. The drive control section performs a process including: receiving a recording instruction specifying at least data to be recorded; storing the data to be recorded in the memory circuit; defining data from a start location of the data stored in the memory circuit to a location corresponding to a next writable address as a first data portion; defining data from the location corresponding to the next writable address to an end location of the data stored in the memory circuit as a second data portion; and controlling the recording/reproduction section to record the second data portion before recording the first data portion.

Abstract: A semiconductor switch includes a first semiconductor circuit having a nonlinear characteristic, and a second semiconductor circuit having a nonlinear characteristic. Each of the first semiconductor circuit and the second semiconductor circuit is configured to at least one of allow and interrupt transmission of a signal. The first semiconductor circuit reduces the nonlinear characteristic of the second semiconductor circuit and the second semiconductor circuit reduces the nonlinear characteristic of the first semiconductor circuit.

Abstract: A disk device controller (1) performs reading/writing of data and management information from/to a first disk device (4) and a second disk device (5). The first disk device (4) and the second disk device (5) hold their device information and storing the management information and the data from the disk device controller (1). A reference device information holder (3) holds previously set reference device information peculiar to the device. A master disk decider (2) decides which one of the first disk device (4) and the second disk device is the master disk, based on the device information and the management information held in the first disk device (4) and the second disk device (5), and the reference device information held in the reference device information holder (3).

Abstract: Trays within a tray feeder provided with electronic components requiring a higher accuracy of mounting position such as QFPs, etc. are collectively placed at one side of a recognition device equipped with a line sensor. A transfer head picks up an electronic component in the tray and discerns a position of the electronic component by moving over the line sensor in one and the same fixed direction at all the time. This scanning direction is the same as a direction of calibration of a nozzle of the transfer head. Accordingly, a detecting error in the position of electronic component caused by the scanning direction is eliminated and the electronic component can be mounted with a high positional accuracy on a substrate.

Abstract: A collector terminal for a non-aqueous electrolyte secondary battery, especially a large-size battery, is provided which is free from breakage when its exterior terminal is fastened with a nut with an excessive torque, superior in electrical conductivity, and high in reliability. The section of the collector terminal forming an exterior terminal and the section where lead plates taken out from the electrode group consist of different types of metals, which are integrated by solid-phase bonding or by vacuum brazing. Among the solid-phase bonding methods, diffusion bonding, explosion pressure welding, and friction bonding are effective.

Abstract: A method of making semiconductor devices with contacts protruding from openings in a passivation layer over an active chip area. Inside each opening, a relatively hard barrier layer is provided and a flash-plated film is applied to subsequently form a relatively soft diffusion barrier layer when a protruding contact is formed. Two semiconductor devices with electrodes are joined by embedding relatively hard electrodes of a first device into relatively soft electrodes of a second device. A reducing agent can be incorporated into an insulating resin applied between semiconductor chips at areas other than the bonded electrodes.

Abstract: The swing centers of guide shafts in inclination adjustment of an optical head are set to be on a plane which is perpendicular to a predetermined radial direction of an optical disk and has thereon the rotation axis of a disk motor. When the inclination adjustment of the optical head is conducted, relative gap variation between the optical head and the optical disk does not occur, and the inclination adjustment is realized within a movable range of an objective lens. The inclination angle of the optical head in a radial direction of the optical disk is adjusted by simultaneously moving upward or downward ends of two guide shafts, and the inclination angle of the optical head in a tangential direction of the optical disk can be adjusted by moving upward and downward one end of at least one of the guide shafts.