Abstract: An air bearing slider for supporting a transducer over a moving recording medium and a method for fabricating such an air bearing slider. The air bearing slider lifts off the recording medium with a predetermined take-off velocity when the recording medium begins to move. The air bearing slider has a first etched region that has a first etch depth and a second etched region that has a second etch depth. The etch depth ratio of the first etch depth to the second etch depth provides a pad-type air bearing slider with a take-off velocity ratio that is greater than or equal to 100%. The etch depth ratio of the first etch depth to the second etch depth provides a rail-type air bearing slider with a take-off velocity ratio that is greater than or equal to approximately 70%.

Abstract: An air bearing slider supports a transducer over a moving recording medium based on air flow generated by the movement of the recording medium. A first pad is formed near a leading edge of the slider and has a first leading edge contoured to provide a first effective length relative to the air flow for the first pad. A second pad is formed near a trailing edge of the slider and has a second leading edge contoured to provide a second effective length relative to the air flow for the second pad. A third pad is formed near the trailing edge of the slider and has a third leading edge which is contoured to provide a third effective length relative to the air flow for the third pad. The first, second, and third effective lengths vary as the air bearing slider moves relative to the moving recording medium to maintain a desired orientation and fly height for the slider during such movement.

Abstract: The present invention relates to a tray used for transporting a number of hard disk drive heads (HDD heads). The tray (10) according to the invention has small-projections provided on a part of the surface of the positioning part (12, 15) which contacts the HDD head (30) when the HDD heads (30) are set in the tray (10). An example of the small-projection (20) is a hemispherical projection (20) whose height is slightly larger than the thickness of the wiring (34) (e.g. about a few to several hundreds of micrometers). Another example of the small-projection is a ridge (21) of about one to several hundreds of micrometers in diameter and about a few millimeters in length. By virtue of such a design, the friction between the wire-applied surface of the HDD head (30) and the positioning part (12, 15) of the tray (10) is substantially reduced because they contact with each other only at the top of the small-projection (20, 21).

Abstract: A top surface imaging technique for top pole tip width control in a magnetoresistive (“MR”) or giant magnetoresistive (“GMR”) read/write head is disclosed in which a multi-layer structure is employed to define the thick photoresist during processing resulting in much improved dimensional control. To this end, a relatively thin upper photoresist layer is patterned with much improved resolution, an intermediate metal or ceramic layer is then defined utilizing the upper photoresist layer as a reactive ion etching (“RIE”) mask, with the intermediate layer then being used as an etching mask to define the bottom-most thick photoresist layer in a second RIE process. As a consequence, a much improved sub-micron pole tip width along with a high aspect ratio and vertical profile is provided together with much improved critical dimension control.

Abstract: A head structure for writing data on a magnetic media including a first pole having an upper surface and a write gap covering a portion of the upper surface. An upper pole tip formed on the write gap having a first width. A second pole having a second width greater than the first width and coupling to an upper surface of the upper pole tip. A conductive coil magnetically coupled to the first pole and the second pole to induce magnetic flux within the first and second pole in response to a current flowing in the coil.

Abstract: A top surface imaging technique for top pole tip width control in a magnetoresistive ("MR") or giant magnetoresistive ("GMR") read/write head is disclosed in which a multi-layer structure is employed to define the thick photoresist during processing resulting in much improved dimensional control. To this end, a relatively thin upper photoresist layer is patterned with much improved resolution, an intermediate metal or ceramic layer is then defined utilizing the upper photoresist layer as a reactive ion etching ("RIE") mask, with the intermediate layer then being used as an etching mask to define the bottom-most thick photoresist layer in a second RIE process. As a consequence, a much improved sub-micron pole tip width along with a high aspect ratio and vertical profile is provided together with much improved critical dimension control.

Abstract: A magnetoresistive read/recording head for use in a fixed disk drive data storage device is formed by the steps of first, photolithographically depositing the head on one surface of a slider block, second, applying, a conductive film preferably of carbon or a silicon/carbon multi-layer film over the head and onto the block surface, and then milling the write tip portion of the head with a focused ion beam. The remaining conductive film is then removed in an oxygen plasma which chemically removes the remaining conductive film. The conductive layer is transparent to the focused ion beam and conducts electrostatic charge away from the head during the milling operation thus preventing electrostatic discharges from occurring which otherwise would damage the head.

Abstract: A process for providing a thin encapsulation layer for thin film heads includes controlling the bias voltage of the substrate and head during the encapsulation layer deposition process. The bias voltage is first maintained at approximately 60 volts while the standard encapsulation overcoat portion of the layer is deposited. This may take approximately one hour. Over the next thirty minutes, the bias voltage is ramped from approximately 60 volts to approximately 200 volts in a gradual, linear manner to reduce the stress on the wafer and heads. The bias voltage is then maintained at approximately 200 volts for the next three hours while the remainder of the encapsulation layer is deposited. Because of the higher bias voltage, the layer is deposited in a substantially planar manner so that there is no need for a lapping back process. Stress to the head is minimized by ramping the bias voltage. In addition, relatively short studs can be used for routing signals to and from the read/write elements of the head.

Abstract: Coherent light passing through slits produces an optical interference pattern having a fringe spacing related to the spacing of the servo tracks on a magnetic disk. The convolution of the interference pattern with the servo tracks generates a servo error signal.