Abstract: Air bearings support a rotating wafer carrying base in an RTP system. The base in proximity to the air bearing is protected from warping due to absorption of radiation from the hot wafer being treated. The most preferred embodiment splits the base into an inner disk carrying the wafer and an outer ring, where the inner ring which absorbs the most energy contacts and is supported at three points by the outer disk which is supported by the air bearing.
Type:
Grant
Filed:
December 11, 1998
Date of Patent:
September 10, 2002
Assignee:
Mattson Technology Corp.
Inventors:
Helmut Aschner, Andreas Hauke, Karsten Weber, Dieter Zernickel