Abstract: A process for treating an electronic component wherein the electronic component is exposed to a heated solvent and subsequently exposed to an ozonated process fluid. The electronic component is optionally exposed to the heated solvent by exposing the electronic component to a passing layer of heated solvent. An apparatus for treating electronic components with a heated solvent and an ozonated process fluid is also provided.
Type:
Grant
Filed:
March 13, 2001
Date of Patent:
December 10, 2002
Assignee:
Mattson Technology IP
Inventors:
Steven Verhaverbeke, Lewis Liu, Alan Walter, C. Wade Sheen, Christopher McConnell