Abstract: A common mode filter includes a plurality of substrates stacked along an axial direction, a first conductor structure and a second conductor structure disposed on the substrates and including a plurality of first rings and second rings disposed sequentially along the axial direction. The first rings and the second rings are disposed to alternate with each other along the axial direction. The first conductor structure and the second conductor structure are spaced apart by a first clearance in a first direction transverse to the axial direction.

Abstract: A method for making a laminated chip includes: (a) forming a first conductive layer on a substrate; (b) forming an insulating layer on the first conductive layer opposite to the substrate; (c) bombarding the insulating layer using an electron beam to form a plurality of holes that expose the first conductive layer; and (d) forming a second conductive layer on the insulating layer such that a part of the second conductive layer extends into the holes to electrically connect to the first conductive layer.

Abstract: A method for making a laminated chip includes: (a) forming a first conductive layer on a substrate; (b) forming an insulating layer on the first conductive layer opposite to the substrate; (c) bombarding the insulating layer using an electron beam to form a plurality of holes that expose the first conductive layer; and (d) forming a second conductive layer on the insulating layer such that a part of the second conductive layer extends into the holes to electrically connect to the first conductive layer.