Patents Assigned to MAX TECH CO., LTD.
  • Patent number: 11521889
    Abstract: The present invention relates to a conductive porous ceramic substrate and a method of manufacturing the same, and more particularly to a conductive porous ceramic substrate, in which a porous ceramic substrate used as a chuck or stage for fixing a thin semiconductor wafer substrate or display substrate through vacuum adsorption is imparted with antistatic performance so as to prevent the generation of static electricity, and a method of manufacturing the same.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: December 6, 2022
    Assignees: MAX TECH CO., LTD., Tri-N CO., LTD.
    Inventors: Byoung Hak Kim, Seung Woo Baik, June Beom Choi, In Woong Kim, Jong Yeol Jung, Chun Moo Lee, Gyu Ha Kim, In Bum Shin
  • Patent number: 10513433
    Abstract: The present disclosure discloses the laminated ceramic chimp component including an element part having a ceramic main body and an internal electrode placed in the ceramic main body; an external electrode part having a first external electrode and a second external electrode, the first and second external electrodes being provided with side electrodes covering both side surfaces of the ceramic main body, respectively, upper electrodes covering portions of both sides of an upper surface of the ceramic main body, respectively, and lower electrodes covering portions of both sides of a lower surface of the ceramic main body, respectively; and a nano thin film layer formed of electric insulation material and applied to a region including the upper electrodes, the method for manufacturing the same and the atomic layer deposition apparatus for the same.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: December 24, 2019
    Assignees: HONGIK UNIVERSITY INDUSTRY-ACADEMIC CORPORATION FOUNDATION, MAX TECH CO., LTD.
    Inventors: Jin Ha Hwang, Dae Bum Park, Yong Jo Choo, Hyun Suk Kim, Da Hee Park, Myeong Hee Ko, Kyoung Woo Kwon, Hee Su Hwang, Jeong Wan Choi