Patents Assigned to Maxconn Incorporated
  • Patent number: 5704802
    Abstract: A modular jack assembly includes a housing having a plug-receiving cavity and an LED assembly attached atop the plug receiving cavity. In a preferred embodiment, the LED assembly is integrally formed with the housing. The LEDs are encased within the LED assembly, being separated from the plug-receiving cavity by a partition. This isolation of the LED helps to minimize the coupling of EMF interference radiated by the leads of the LED while they are operating to the underlying contact pins. Contact pins disposed within the plug-receiving cavity each have a contacting portion which extends along the roof of the cavity. The contacting portions have a varying measure of separation from the roof along their extent. This provides further separation from the LED leads which are disposed above the contact pins in the LED assembly, further lessening the EMF coupling with the LED leads. In an alternate embodiment, the modular jack has a stacked form factor and can be ganged to form a bank of modular jacks.
    Type: Grant
    Filed: June 14, 1996
    Date of Patent: January 6, 1998
    Assignee: Maxconn Incorporated
    Inventor: Gregory Loudermilk
  • Patent number: 5687233
    Abstract: A modular jack includes a filter circuit for each of the transmit and receive pins in order to shape the signal waveforms, isolate the user from the line, and filter out both common and differential mode noise in high-speed communications systems, such as 10BASE-T, 100BASE-T, token ring and ATM applications. The manufacture of the modular jack of the present invention is simplified by the design of the components which make up the modular jack assembly. More specifically, the contact pins of the modular jack are divided into a contact pin array and a mounting pin array. The two pin arrays are electrically coupled through a printed circuit board which carries the two filters. A platform formed on the mounting pin array facilitates the attachment of the printed circuit board during manufacture.
    Type: Grant
    Filed: February 9, 1996
    Date of Patent: November 11, 1997
    Assignee: Maxconn Incorporated
    Inventors: Gregory Loudermilk, Anthony E. Imburgia
  • Patent number: 5639267
    Abstract: A modular jack assembly includes a housing having a front portion which includes a plurality of openings into a plurality of plug receiving chambers. The housing further has a rear bay which includes openings into the plug receiving chambers. A backplate sub-assembly includes a plurality of contact pin arrays mounted thereto and a grounding shield. Each of the pin arrays is formed of a unitary insulative member in the shape of an L and includes a plurality of embedded contact pins. The backplate sub-assembly further includes an L-shaped elongate backplate member having perforations formed through one of the legs of the L. The perforations receive pins protruding from mounting ends of the pin arrays. Additional perforations are provided to receive ground pins formed in the grounding shield. The backplate sub-assembly is received in the rear bay so that plug contacting portions of the pin arrays extend into the plug receiving chambers.
    Type: Grant
    Filed: January 26, 1996
    Date of Patent: June 17, 1997
    Assignee: Maxconn Incorporated
    Inventor: Gregory Loudermilk
  • Patent number: 5502892
    Abstract: A method of forming a module includes positioning a circuit card, such as a memory card, between separate frameworks and welding the frameworks together to encase the circuit card. The frameworks are preferably welded using sonic wave energy, thereby further enhancing the structural strength of the assembly. The assembly also includes cover and base panels. The panels are bent to further enhance the structural strength. In the preferred embodiment, the frameworks are injection molded onto the panels.
    Type: Grant
    Filed: July 1, 1994
    Date of Patent: April 2, 1996
    Assignee: Maxconn Incorporated
    Inventor: Teh-Sou Lien
  • Patent number: 5288244
    Abstract: An electrical connector assembly and method includes a connector body and at least one unitary fastening member that is deformed at a central region of the fastening member after insertion through a mounting hole in the connector body. Projecting integrally from the deformed region of the fastening member is an internally threaded post which may receive cable screws of a cable mated with the connector assembly. In a preferred embodiment, the fastening member secures a ground strap and a faceplate to the connector body, and the internally threaded post is inserted through a panel of a computer system component.
    Type: Grant
    Filed: April 19, 1993
    Date of Patent: February 22, 1994
    Assignee: Maxconn Incorporated
    Inventor: Teh-Sou Lien
  • Patent number: 4878856
    Abstract: A stacked electrical connector having a plurality of connector members for attachment to cables of an opposite gender and having angulate contacts which are arranged in a plurality of parallel rows that are received by a printed circuit board or the like. Each connector member has a cable-supporting face and mounting holes on opposed sides of the face. Each bracket of a pair of L-shaped brackets includes a horizontal plate and a vertical plate, with the vertical plate having eyelets aligned with the mounting holes of the connector members. An internally threaded post is inserted into each eyelet and the aligned mounting hole, and is fixed in place. Thus, the L-shaped brackets support the connector members in fixed relation. The posts are internally threaded to receive fastening hardware to mechanically attach a cable to the associated connector member. The vertical plate of each L-shaped bracket extends along a plane common to the base side of the lowermost connector member.
    Type: Grant
    Filed: March 20, 1989
    Date of Patent: November 7, 1989
    Assignee: Maxconn Incorporated
    Inventor: Jack A. Maxwell