Abstract: Techniques are described to provide a universal direct docking tester to prober interface between the test head and a prober of semiconductor wafer prober for testing die within semiconductor wafers. In an implementation, a universal direct docking tester to prober interface includes a tray assembly configured to be mounted within an opening of the prober housing and a stiffener assembly configured to be mounted to a test head to support a load board PCB that includes a probe head. The stiffener assembly includes a skirt that is received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober to facilitate engagement of the probe head with the wafer.

Abstract: Various embodiments of the present invention relate to systems, devices and method of frequency synthesis that generate in-phase and quadrature-phase clock signals at a programmable frequency. The generated frequency, which can range from a fraction to multiples of the input reference frequency, is generated by dividers following a phase-locked loop, thus avoiding the use of a low input reference frequency as well as frequency doubling.

Abstract: A light management unit (LMU) includes multiple brightness compensation modules and algorithms mixed together in a digital domain. The LMU is configured to receive content data, such as gamma correction data generated by a graphics or video processor and corresponding to frames of video data, ambient light data obtained using a light sensor, ambient temperature data using a temperature sensor, and a manual brightness setting. An ambient light compensation value is multiplied into the manual brightness settings so the resulting compensation value is a percent of the manual settings. A content adjustment interface (CAI) module is configured to compensate the backlight brightness according to real-time video data. The content adjustment performed by the CAI module is combined with the ambient light adaptive dimming. A final stage step generator enables a gradual brightness transition to minimize, if not eliminate jitter and jump.

Abstract: Disclosed are systems and methods for improving the thermal performance of integrated circuit packages. Aspects of the present invention include improved thermal package structures and methods for producing the same through the application of one or more thermal spreaders in the package. In embodiments, a thermal spreader is incorporated in a semiconductor chip package between a semiconductor die and its die pad. By including a thermal spreader in an IC package, the package can handle higher levels of power while maintaining approximately the same temperature of the package or can reduce the temperature of the package when operating at the same power level, as compared to a package without a thermal spreader.

Abstract: A method for encoding video, comprising the steps of (A) encoding a number of macroblocks of a video signal with a non-residual mode disabled, (B) checking each of the macroblocks for a null information pattern, and (C) re-encoding each of the macroblocks having the null information pattern with the non-residual mode enabled.

Abstract: A zero-crossing detector with effective offset cancellation includes a set of series connected capacitors and an amplifier having an input terminal. An offset capacitor is operatively connected between the amplifier and the set of series connected capacitors. A switch is operatively connected to the input terminal, and an offset sampling capacitor is operatively connected to the switch. The switch connects the offset sampling capacitor to the input terminal of the amplifier during a charge transfer phase.