Patents Assigned to Maxwell Electronic Components Group, Inc.
  • Publication number: 20040252443
    Abstract: A long life double layer capacitor and method of making the same including a case and a first terminal with an electrically insulating hermitic seal interposed between the first terminal and the case. A first current collector foil is electrically coupled to an interior portion of the first terminal and a first electrode comprising carbon which is juxtaposed against the first current collector foil. A porous separator is then juxtaposed against the first electrode comprising carbon and separating the first electrode from a second electrode comprising carbon. A second current collector foil is juxtaposed against a side of the second electrode and is electrically coupled to the second terminal.
    Type: Application
    Filed: March 31, 2004
    Publication date: December 16, 2004
    Applicant: Maxwell Electronic Components Group, Inc.
    Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Robert W. Crawford, Chenniah Nanjundiah
  • Publication number: 20040217449
    Abstract: An electronic component package and a method of forming the package are disclosed. The package includes a die having a top face with set of contacts and a substrate having a cutout therein. The die may include a memory component and may include SDRAM. The substrate is mounted on the top face, and the cutout overlays the set of contacts. Wire leads extend from the set of contacts, at least partially through the cutout, to the substrate. The set of contacts may be positioned along a central region of the die, and the cutout overlays the central region. The wire leads extend to the substrate and may contact the substrate proximate to the cutout. The package may further include a set of electrical paths extending from the wire leads through the substrate for providing communicative path between the die and an external component.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 4, 2004
    Applicant: Maxwell Electronic Components Group, Inc.
    Inventor: Janet Suzanne Patterson
  • Publication number: 20040056334
    Abstract: A radiation shielding integrated circuit device comprising a x-ray shielding layer for shielding an electronic circuit device from receiving an amount of x-rays greater than the total dose tolerance of the electronic circuit device; a base coupled to the x-ray shielding layer; a radiation shielding top coupled to the base; a radiation shielding bottom coupled to the base; and the electronic circuit device coupled to the x-ray shielding layer; wherein the electronic circuit device is shielded from receiving an amount of radiation greater than a total dose tolerance of the electronic circuit device.
    Type: Application
    Filed: September 25, 2002
    Publication date: March 25, 2004
    Applicant: Maxwell Electronic Components Group, Inc.
    Inventors: Larry L. Longden, Janet Patterson
  • Publication number: 20040031618
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Application
    Filed: August 18, 2003
    Publication date: February 19, 2004
    Applicants: Maxwell Electronic Components Group, Inc., Space Electronics, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Publication number: 20030090917
    Abstract: An isolated power input architecture that includes hot swappable input modules that are electrically isolated from each other so that each may provide input power to power supplies for an electronic device without adverse interactions between the voltages provided by each input module. The isolated input modules are each configured to lock the other out so that only one input module is providing power to the power supplies for the electronic device. The power supply for the electronic device preferably includes N+1 power supplies where N power supplies are required by the electronic device. Either of the isolated input modules provides enough power to supply power to all the N+1 power supplies.
    Type: Application
    Filed: May 31, 2002
    Publication date: May 15, 2003
    Applicant: Maxwell Electronic Components Group, Inc.
    Inventors: Johni Chan, Guy Thrap
  • Publication number: 20030086239
    Abstract: A method of making a double layer capacitor, in accordance with one embodiment, includes coupling a top collector disk to a proximal end of a double layer capacitor electrode assembly; electrically coupling a bottom collector disk to a distal end; heating a can; inserting the double layer capacitor electrode assembly into the can; cooling the can, wherein a peripheral edge of the bottom collector disk is coupled to the can as the diameter of the can is decreased; forming a bead around an exterior of the can; heating a lid; placing a concave structure of the lid in juxtaposition with a convex structure on the top collector disk; cooling the lid, wherein the concave structure is coupled to the convex structure as the diameter of the can is decreased; creating a seal between the lid and the can; and placing an electrolyte solution into the electrode assembly.
    Type: Application
    Filed: May 29, 2002
    Publication date: May 8, 2003
    Applicant: Maxwell Electronic Components Group, Inc., a Delaware Corporation
    Inventors: Priya Bendale, Manuel R. Malay, John M. Dispennette, Chenniah Nanjundiah, Frederic Spiess
  • Publication number: 20030030969
    Abstract: A long life double layer capacitor and method of making the same including a case and a first terminal with an electrically insulating hermitic seal interposed between the first terminal and the case. A first current collector foil is electrically coupled to an interior portion of the first terminal and a first electrode comprising carbon which is juxtaposed against the first current collector foil. A porous separator is then juxtaposed against the first electrode comprising carbon and separating the first electrode from a second electrode comprising carbon. A second current collector foil is juxtaposed against a side of the second electrode and is electrically coupled to the second terminal.
    Type: Application
    Filed: September 6, 2002
    Publication date: February 13, 2003
    Applicant: Maxwell Electronic Components Group, Inc.
    Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Robert W. Crawford, Chenniah Nanjundiah
  • Publication number: 20030025089
    Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.
    Type: Application
    Filed: September 18, 2002
    Publication date: February 6, 2003
    Applicant: Maxwell Electronic Components Group, Inc.
    Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li
  • Publication number: 20020148979
    Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.
    Type: Application
    Filed: November 30, 2000
    Publication date: October 17, 2002
    Applicant: MAXWELL ELECTRONIC COMPONENTS GROUP, INC.
    Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li
  • Patent number: 6455864
    Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.
    Type: Grant
    Filed: November 30, 2000
    Date of Patent: September 24, 2002
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li
  • Patent number: 6451073
    Abstract: A single cell, multi-electrode high performance double layer capacitor includes first and second flat stacks of electrodes adapted to be housed in a closeable two-part capacitor case which includes only a single electrolyte seal. Each electrode stack has a plurality of electrodes connected in parallel, with the electrodes of one stack being interleaved with the electrodes of the other stack to form an interleaved stack, and with the electrodes of each stack being electrically connected to respective capacitor terminals. A porous separator is positioned against the electrodes of one stack before interleaving to prevent electrical shorts between the electrodes. The electrodes are made by folding a compressible, low resistance, aluminum-impregnated carbon cloth, made from activated carbon fibers, around a current collector foil, with a tab of the foils of each electrode of each stack being connected in parallel and connected to the respective capacitor terminal.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: September 17, 2002
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Alan C. Kolb
  • Patent number: 6449139
    Abstract: A long life double layer capacitor and method of making the same including a case and a first terminal with an electrically insulating hermitic seal interposed between the first terminal and the case. A first current collector foil is electrically coupled to an interior portion of the first terminal and a first metal impregnated carbon cloth electrode having a metal impregnated side which is juxtaposed against the first current collector foil. A porous separator is then juxtaposed against the first metal impregnated carbon cloth electrode and separating the first metal impregnated carbon cloth electrode from a second metal impregnated carbon cloth electrode having a metal impregnated side which faces away from the porous separator. A second current collector foil is juxtaposed against the metal impregnated side of the second metal impregnated carbon cloth electrode and is electrically coupled to the second terminal.
    Type: Grant
    Filed: August 18, 1999
    Date of Patent: September 10, 2002
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Robert W. Crawford, Chenniah Nanjundiah
  • Patent number: 6430031
    Abstract: An ultrasonically bonded electrical interconnection for use in a double layer capacitor consists of ten or more current collector foils bonded together and at least one dummy collector foil bonded to the ten or more current collector foils. The at least one dummy collector foil does not function as a current collector foil as a result of the ultrasonic bonding.
    Type: Grant
    Filed: February 12, 2001
    Date of Patent: August 6, 2002
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: John M. Dispennette, Edward Blank, Robert W. Crawford
  • Patent number: 6368899
    Abstract: A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.
    Type: Grant
    Filed: March 8, 2000
    Date of Patent: April 9, 2002
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: Michael Featherby, Jennifer L. DeHaven
  • Patent number: 6262362
    Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: July 17, 2001
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
  • Patent number: 6261508
    Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.
    Type: Grant
    Filed: August 17, 1999
    Date of Patent: July 17, 2001
    Assignee: Maxwell Electronic Components Group, Inc.
    Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li