Patents Assigned to Maxwell Electronic Components Group, Inc.
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Publication number: 20040252443Abstract: A long life double layer capacitor and method of making the same including a case and a first terminal with an electrically insulating hermitic seal interposed between the first terminal and the case. A first current collector foil is electrically coupled to an interior portion of the first terminal and a first electrode comprising carbon which is juxtaposed against the first current collector foil. A porous separator is then juxtaposed against the first electrode comprising carbon and separating the first electrode from a second electrode comprising carbon. A second current collector foil is juxtaposed against a side of the second electrode and is electrically coupled to the second terminal.Type: ApplicationFiled: March 31, 2004Publication date: December 16, 2004Applicant: Maxwell Electronic Components Group, Inc.Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Robert W. Crawford, Chenniah Nanjundiah
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Publication number: 20040217449Abstract: An electronic component package and a method of forming the package are disclosed. The package includes a die having a top face with set of contacts and a substrate having a cutout therein. The die may include a memory component and may include SDRAM. The substrate is mounted on the top face, and the cutout overlays the set of contacts. Wire leads extend from the set of contacts, at least partially through the cutout, to the substrate. The set of contacts may be positioned along a central region of the die, and the cutout overlays the central region. The wire leads extend to the substrate and may contact the substrate proximate to the cutout. The package may further include a set of electrical paths extending from the wire leads through the substrate for providing communicative path between the die and an external component.Type: ApplicationFiled: April 30, 2003Publication date: November 4, 2004Applicant: Maxwell Electronic Components Group, Inc.Inventor: Janet Suzanne Patterson
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Publication number: 20040056334Abstract: A radiation shielding integrated circuit device comprising a x-ray shielding layer for shielding an electronic circuit device from receiving an amount of x-rays greater than the total dose tolerance of the electronic circuit device; a base coupled to the x-ray shielding layer; a radiation shielding top coupled to the base; a radiation shielding bottom coupled to the base; and the electronic circuit device coupled to the x-ray shielding layer; wherein the electronic circuit device is shielded from receiving an amount of radiation greater than a total dose tolerance of the electronic circuit device.Type: ApplicationFiled: September 25, 2002Publication date: March 25, 2004Applicant: Maxwell Electronic Components Group, Inc.Inventors: Larry L. Longden, Janet Patterson
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Publication number: 20040031618Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.Type: ApplicationFiled: August 18, 2003Publication date: February 19, 2004Applicants: Maxwell Electronic Components Group, Inc., Space Electronics, Inc.Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
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Publication number: 20030090917Abstract: An isolated power input architecture that includes hot swappable input modules that are electrically isolated from each other so that each may provide input power to power supplies for an electronic device without adverse interactions between the voltages provided by each input module. The isolated input modules are each configured to lock the other out so that only one input module is providing power to the power supplies for the electronic device. The power supply for the electronic device preferably includes N+1 power supplies where N power supplies are required by the electronic device. Either of the isolated input modules provides enough power to supply power to all the N+1 power supplies.Type: ApplicationFiled: May 31, 2002Publication date: May 15, 2003Applicant: Maxwell Electronic Components Group, Inc.Inventors: Johni Chan, Guy Thrap
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Publication number: 20030086239Abstract: A method of making a double layer capacitor, in accordance with one embodiment, includes coupling a top collector disk to a proximal end of a double layer capacitor electrode assembly; electrically coupling a bottom collector disk to a distal end; heating a can; inserting the double layer capacitor electrode assembly into the can; cooling the can, wherein a peripheral edge of the bottom collector disk is coupled to the can as the diameter of the can is decreased; forming a bead around an exterior of the can; heating a lid; placing a concave structure of the lid in juxtaposition with a convex structure on the top collector disk; cooling the lid, wherein the concave structure is coupled to the convex structure as the diameter of the can is decreased; creating a seal between the lid and the can; and placing an electrolyte solution into the electrode assembly.Type: ApplicationFiled: May 29, 2002Publication date: May 8, 2003Applicant: Maxwell Electronic Components Group, Inc., a Delaware CorporationInventors: Priya Bendale, Manuel R. Malay, John M. Dispennette, Chenniah Nanjundiah, Frederic Spiess
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Publication number: 20030030969Abstract: A long life double layer capacitor and method of making the same including a case and a first terminal with an electrically insulating hermitic seal interposed between the first terminal and the case. A first current collector foil is electrically coupled to an interior portion of the first terminal and a first electrode comprising carbon which is juxtaposed against the first current collector foil. A porous separator is then juxtaposed against the first electrode comprising carbon and separating the first electrode from a second electrode comprising carbon. A second current collector foil is juxtaposed against a side of the second electrode and is electrically coupled to the second terminal.Type: ApplicationFiled: September 6, 2002Publication date: February 13, 2003Applicant: Maxwell Electronic Components Group, Inc.Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Robert W. Crawford, Chenniah Nanjundiah
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Publication number: 20030025089Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.Type: ApplicationFiled: September 18, 2002Publication date: February 6, 2003Applicant: Maxwell Electronic Components Group, Inc.Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li
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Publication number: 20020148979Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.Type: ApplicationFiled: November 30, 2000Publication date: October 17, 2002Applicant: MAXWELL ELECTRONIC COMPONENTS GROUP, INC.Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li
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Patent number: 6455864Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.Type: GrantFiled: November 30, 2000Date of Patent: September 24, 2002Assignee: Maxwell Electronic Components Group, Inc.Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li
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Patent number: 6451073Abstract: A single cell, multi-electrode high performance double layer capacitor includes first and second flat stacks of electrodes adapted to be housed in a closeable two-part capacitor case which includes only a single electrolyte seal. Each electrode stack has a plurality of electrodes connected in parallel, with the electrodes of one stack being interleaved with the electrodes of the other stack to form an interleaved stack, and with the electrodes of each stack being electrically connected to respective capacitor terminals. A porous separator is positioned against the electrodes of one stack before interleaving to prevent electrical shorts between the electrodes. The electrodes are made by folding a compressible, low resistance, aluminum-impregnated carbon cloth, made from activated carbon fibers, around a current collector foil, with a tab of the foils of each electrode of each stack being connected in parallel and connected to the respective capacitor terminal.Type: GrantFiled: May 16, 2000Date of Patent: September 17, 2002Assignee: Maxwell Electronic Components Group, Inc.Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Alan C. Kolb
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Patent number: 6449139Abstract: A long life double layer capacitor and method of making the same including a case and a first terminal with an electrically insulating hermitic seal interposed between the first terminal and the case. A first current collector foil is electrically coupled to an interior portion of the first terminal and a first metal impregnated carbon cloth electrode having a metal impregnated side which is juxtaposed against the first current collector foil. A porous separator is then juxtaposed against the first metal impregnated carbon cloth electrode and separating the first metal impregnated carbon cloth electrode from a second metal impregnated carbon cloth electrode having a metal impregnated side which faces away from the porous separator. A second current collector foil is juxtaposed against the metal impregnated side of the second metal impregnated carbon cloth electrode and is electrically coupled to the second terminal.Type: GrantFiled: August 18, 1999Date of Patent: September 10, 2002Assignee: Maxwell Electronic Components Group, Inc.Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Robert W. Crawford, Chenniah Nanjundiah
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Patent number: 6430031Abstract: An ultrasonically bonded electrical interconnection for use in a double layer capacitor consists of ten or more current collector foils bonded together and at least one dummy collector foil bonded to the ten or more current collector foils. The at least one dummy collector foil does not function as a current collector foil as a result of the ultrasonic bonding.Type: GrantFiled: February 12, 2001Date of Patent: August 6, 2002Assignee: Maxwell Electronic Components Group, Inc.Inventors: John M. Dispennette, Edward Blank, Robert W. Crawford
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Patent number: 6368899Abstract: A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.Type: GrantFiled: March 8, 2000Date of Patent: April 9, 2002Assignee: Maxwell Electronic Components Group, Inc.Inventors: Michael Featherby, Jennifer L. DeHaven
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Patent number: 6262362Abstract: The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.Type: GrantFiled: July 2, 1998Date of Patent: July 17, 2001Assignee: Maxwell Electronic Components Group, Inc.Inventors: David R. Czjakowski, Neil Eggleston, Janet S. Patterson
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Patent number: 6261508Abstract: The radiation shielding composition and method of the present invention relate to a conformal coating material composed of a matrix of densely packed radiation shielding particles, which are disbursed within a binder. The shielding composition is applied to objects to be protected such as integrated circuits, or to packages therefor, as well as for protecting animals including humans from unwanted exposure to radiation in outer space or other environments.Type: GrantFiled: August 17, 1999Date of Patent: July 17, 2001Assignee: Maxwell Electronic Components Group, Inc.Inventors: Michael Featherby, David J. Strobel, Phillip J. Layton, Edward Li