Abstract: A die location pin to be used with a die of the type having a pin recess and shaped to be mounted on an associated bolster having a complementary pin recess. The pin includes a central shaft which supports a slide member engaging upper and lower resilient members positioned in the die and bolster recesses, respectively. Upper and lower collar members are fixed relative to the die and bolster and engage the upper and lower resilient members on sides opposite of that engaged by the slide member. The die includes a shoulder which, when the die is placed upon the bolster, engages a shoulder of the slide member to urge the slide member downwardly such that the upper and lower resilient members are compressed against the upper and lower collar members, respectively, thereby forcing the resilient members to expand radially outwardly to eliminate clearance between the pin and pin recess in the die and bolster in order to provide a more precise pin location function.