Abstract: A method is provided for depositing on a gravure roll a layer of copper especially adapted to receive electronic engraving comprising the steps of placing a gravure roll in an electroplating bath comprising from about 150 to about 225 grams/liter of copper sulfate from about 35 to about 90 grams/liter of sulfuric acid, from about 1 to about 15 grams/liter of a polyether having a molecular weight from about 4,000 to about 10,000, from about 0.3 to about 3.0 milligrams/liter of 1-lower alkyl-2-mercapto imidazole, and from about 1 to about 100 milligrams/liter of a sulfonated, sulfurized benzene compound; and passing electrical current through the bath to deposit copper on said roll.

Abstract: An aqueous acidic electroplating bath for the deposition of zinc is provided which comprises zinc ions in an amount sufficient to deposit zinc metal on a substrate, chloride ions in an amount sufficient to impart electrical conductivity to said bath, boric acid in an amount sufficient to buffer said bath to the desired pH, and an effective amount of at least one brightener selected from the group consisting of (i) condensation products of aromatic aldehydes with amides and (ii) condensation products of aromatic aldehydes with urea or substituted ureas.

Abstract: A tin-palladium catalyst useful for electroless deposition of metals, such as copper or nickel, onto a nonconductive substrate, said catalyst containing a much lower concentration of halide ions than similar compositions presently known, or being completely free of halide ions. The tin-palladium catalyst can be prepared from nonhalide salts using a hydroxy substituted organic acid to stabilize the system.

Abstract: An electroless plating catalyst prepared by reacting a tin salt in the molten state with a precious metal complex. The final catalyst may be a solid or a liquid at room temperature, depending upon the reaction conditions, and it can be reconstituted by dilution with an appropriate aqueous solution to prepare or replenish catalytic working baths for electroless plating. Examples include the molten salt reaction of precious metal complexes with anhydrous stannous chloride or stannous chloride dihydrate.

Abstract: The present invention relates to additives for electroplating baths used for the electrodeposition of zinc-copper alloys, and particularly to such alloys designed to be used as undercoats for subsequently applied metal coatings. The improvement comprises additives for incorporation into conventional zinc-copper electrolytes, comprising a mixture of a buffering agent selected from the group consisting of boric acid, alkali metal borates, alkali metal carbonates, alkali metal phosphates and glycine, a metal ion selected from the group consisting of nickel ion and cobalt ion, and ethylenediaminetetra acetic acid (as the alkali metal salt).