Abstract: The device for inserting at least one semiconductor component into a receiving portion, particularly into a test socket for testing the electric function of the semiconductor component, comprises at least one receiving space (46) for the semiconductor component (12), the receiving space (46) comprising a receiving opening (56). Further, the device comprises at least one moveable member (14) supported on element (34) whereby semiconductor component (12) is carried in a moving direction (58) through said receiving opening (56) into the receiving space (46). The pushing element (34) comprising a gas cushion generating means (62) for generating a gas cushion (60) is adapted to support the semiconductor component (12) at least in the receiving opening (56). Heating and cooling means (68) are provided by which the air out-flowing as an air cushion (60) can be brought to a desired temperature (FIG. 2).

Abstract: A method and system for sorting IC-components into pre-definable classes of criteria simultaneously remove a plurality of the IC-components from receiving portions of a tray using a plurality of gripping devices. Each of the gripping devices having an access area that is separate from access areas associated with the other gripping devices. The tray is moved in steps past the gripping devices. Each of the gripping devices is controlled to remove from the receiving portions of the tray only the IC-components belonging to one class of criteria assigned to the access area of the respective gripping device.