Abstract: An interconnect for BGA packages, a BGA package fabricated using the interconnect, and a method for fabricating BGA packages using the interconnect, are provided. The interconnect includes multiple polymer substrates on which patterns of conductors are formed. Each substrate can be used to fabricate a BGA package. The conductors on the substrates include end portions having bonding vias formed therethrough in alignment with access openings in the substrates. During fabrication of the BGA packages, the bonding vias allow the conductors to be bonded to bond pads on semiconductor dice by forming metal bumps on the bonding vias and bond pads. The access openings in the substrates provide access to the bonding vias and bond pads for a bonding tool configured to form the metal bumps. In addition to the bonding vias, the conductors include ball bonding pads configured for attaching ball contacts, such as solder balls, to the conductors and substrates.