Patents Assigned to Mcronix International Co., Ltd.
  • Chemical mechanical polishing method and system
    Patent number: 8602838
    Abstract: A chemical mechanical polishing method is provided. The chemical mechanical polishing method includes steps of providing a plurality of semiconductor elements to be polished, obtaining a respective dimension of the each semiconductor element to be polished, and polishing the each semiconductor element according to the respective dimension thereof.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: December 10, 2013
    Assignee: Mcronix International Co., Ltd.
    Inventors: Meng-Yi Shen, Liang-Yu Hu, Tsung-Hsuan Ho, Sheng-I Tseng