Abstract: A sensor includes a substrate having a curved surface, a piezoelectric element, and an adhesive disposed between the piezoelectric element and the curved surface along a vertical direction. The adhesive attaches the piezoelectric element to the substrate. The adhesive has an exterior bond surface that has a tapered shape along the vertical direction from the piezoelectric element to the curved surface.

Abstract: A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.

Abstract: The present application provides a sensor, relates to sensing technology field, the sensor includes a sensor body, a main circuit module disposed in the sensor body and an sensing assembly electrically connect to the main circuit module, and further includes a circuit protection module disposed at outside of the sensor body and electrically connected to the main circuit module. In the present application, the main circuit module and the sensing assembly are used as the core components to achieve the functions of sensing and information conversion of the sensor; the circuit protection module is disposed outside the sensor body to realize the circuit protection function of the sensor.

Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Abstract: A stator winding temperature sensor including at least one sensing wire for connecting to a stator. The sensor also includes a body, including a core material comprising a polyimide substrate having an acrylic adhesive surrounding at least a portion of the sensing wire, and a laminate material over the core material. The body has a thickness adapted to protect the sensing wire. The sensor includes a lead wire for connecting to an external monitoring device. The sensing wire is electrically connected to the lead wire at a lead step portion of the sensor. The sensor further includes a tab extending from the lead wire and encompassing the lead step, the tab including a flexible zone where the tab is surrounded by a polyimide and an adhesive but is not surrounded by fiberglass.

Abstract: A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Abstract: A pressure sensor in accordance with the invention comprises a die having pressure-sensing electrical components formed in a first side of the die. In one embodiment, a method of securing a cap to a silicon die is provided comprising forming a thin glass particle layer on a bonding area of the cap, heating the cap and the thin glass particle layer on the bonding area to form a substantially continuous glass layer on the bonding area, and heating the cap and silicon die to a temperature above the melting point of the glass to form a bond between the cap and the silicon die.

Abstract: A resonant-type transducer providing a narrow band, high output or high sensitivity signal to a radiation medium, the resonant transducer comprising a vibrator body comprising piezoelectric or electrorestricitive material having a first acoustic impedance at a resonant condition, and a matching layer for acoustically matching the piezoelectric vibrator body at resonance to the radiation medium.

Abstract: A circuit for measuring body impedance comprising a voltage source having a predetermined frequency and a current source; a first pair of electrodes adapted to receive one portion of the body for applying said current source to said body; a second pair of electrodes adapted to receive another portion of the body for sensing a voltage therebetween; a comparator having first and second inputs and an output for producing an output signal based on signals applied to said first and second inputs; an instrumentation amplifier arrangement coupled to one of said comparator inputs and responsive to the voltage across the second pair of electrodes for providing an input signal to said first comparator input; a variable resistor coupled to the second input of said comparator and responsive to said voltage source for developing a first voltage signal applied to said second comparator input; and a processor responsive to the output signal of the comparator for controlling the resistance of the variable resistor to cause a