Abstract: Sensor devices and methods of operating for use with catheter-based treatments of microcardial microvascular obstruction by infusion of fluids having protective agents into vasculature are provided herein. Such catheter devices can include a first lumen configured for advancement over a guidewire and for passage of fluid having protective agents after removal of the guidewire and a second lumen for inflation of an angioplasty balloon and can further include a temperature and/or pressure sensor mounted on the catheter body. Such catheter devices can further include use of a distal occlusive membrane between the angioplasty balloon and distal end to facilitate infusion into microvasculature. The occlusive membrane can be deployed by relative movement of concentric channels, thereby reducing the need for additional lumen while optimizing the size of the catheter device and lumens.

Abstract: A body of a sensor includes a wafer having a cavity and a membrane deflectable into the cavity under an applied force. The membrane has a first section and a second section. The first section of the membrane is more deflectable than the second section in a first range of the applied force and the second section is more deflectable than the first section in a second range of the applied force that is different than the first range.

Abstract: Pressure sensors that can be reliability operated with the maximum current flowing through the device restricted to 10 uA or below, or below 50 uA in a single-fault condition. This can provide at least a reduced need for the final medical device architect to consider potential risks from excessive current to the patient, simplifying the design and manufacturability of the medical device. An additional benefit is that the sensors are generally more accurate at lower current flow, as self-heating of the resistors and parasitic leakages are reduced, if the signal-to-noise problem is resolved.

Abstract: A sensor assembly includes a sensor generating a sensor signal, an output unit and a condition unit receiving the sensor signal output from the sensor, and a test line connected to the sensor and the condition unit. The output unit outputs a signal output representative of a state detected by the sensor. The condition unit outputs a condition output representative of a condition of the sensor. The test line is bidirectional and outputs the condition output.

Abstract: A sensor assembly includes a carrier having a base wall and a pair of side walls extending from the base wall, and a sensor mounted on the base wall between the side walls. Each of the side walls has a side step between a first side section and a second side section extending from the first side section along a longitudinal direction of the carrier. A sensor die of the sensor is spaced in a width direction perpendicular to the longitudinal direction by a first lateral gap distance from the first side section and by a second lateral gap distance from the second side section. The second lateral gap distance is greater than the first lateral gap distance.

Abstract: A sensing device includes a body having a first chamber, a second chamber, and a liquid path which are filled with a liquid, the liquid path communicates with the second chamber, a pressure difference detection chip installed in the first chamber, and a pressure detection chip installed in the first chamber. The pressure difference detection chip seals an opening of the liquid path disposed on a bottom surface of the first chamber. The pressure difference detection chip detects a liquid pressure difference between the first chamber and the second chamber. The pressure detection chip detects a liquid pressure in the first chamber.

Abstract: Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.

Abstract: A digital pressure sensor includes a substrate, a pressure sensing structure configured for measuring a pressure of an object to be measured, a signal processing chip configured for receiving a sensing signal of the pressure sensing structure, and a rubber cover having an opening through which the pressure is sensed. The pressure sensing structure and the signal processing chip are mounted on the substrate. The signal processing chip has an analog-digital conversion module that converts the sensing signal output by the pressure sensing structure into a digital signal and outputs the digital signal. The signal processing chip is electrically connected to the substrate. The substrate and the rubber cover are connected to each other and form a mounting cavity for holding the pressure sensing structure and the signal processing chip.

Abstract: Semiconductor MEMS pressure sensors that can produce a linear and large output signal when subject to a small pressure, without an increase to the front to back span error. One example can experience large deflections without causing catastrophic damage to the membrane. The pressure sensor can include a silicon layer having opposing surfaces, an etched pattern in of the surfaces of the silicon layer, and an etched cavity on the opposite surface of the silicon layer to form a membrane. The etched patterned can include a series of concentric stiffening ribs, an inverted boss, large depression areas next to the membrane edge and/or the boss, and piezoresistive strain concentrators. The ribs and depressions can be formed onto the silicon membrane by anisotropic or isotropic etch techniques. Piezoresistive devices can be diffused into the membrane in the regions near the strain concentrators to form a Wheatstone bridge or other measurement structure.

Abstract: Contact-force-sensing systems that can provide additional information about the forces that are applied by catheters and other devices to cell walls and other surfaces. One example can provide directional information for a contact-force-sensing system. For example, magnitude, plane angle, and off-plane angle information can be provided by a contact-force-sensing system. Another example can provide guiding functionality for a contact-force-sensing system. For example, a contact-force-sensing system can provide tactile response to a surgeon or operator to allow a device to be accurately guided though a body.

Abstract: A bubble detection sensor includes an emitter having an emitting surface and a receiver positioned on a side of a fluid conduit opposite the emitter. The receiver has a receiving surface adapted to receive a signal emitted by the emitter through a fluid of the fluid conduit. A sensor axis extending normal to the emitting surface and the receiving surface is disposed at a rotation offset angle with respect to a plane extending normal to a longitudinal conduit axis of the fluid conduit. The rotation offset angle is set to optimize a ratio of a sensitivity of the signal received by the receiver to an efficiency of the signal received by the receiver.

Abstract: A constraint for a sensor assembly includes a silicon wafer and a flexible structure. The silicon wafer has a first side, a second side opposite to the first side, and a passageway extending through the silicon wafer from the first side to the second side. The first side is a continuous planar surface except for the passageway. The flexible structure extends from the second side.

Abstract: Reliable flow sensors with enclosures that have predictable thermal variations and reduced mechanical tolerances for a more consistent fluid flow and more consistent flow measurements. Thermal variations can be made predictable by using etched structures in silicon blocks. Mechanical tolerances can be reduced using lithography and high-precision semiconductor manufacturing equipment and techniques.

Abstract: A strain gauge includes a resistor formed of a doped silicon material, a conductive shield, and an isolation element disposed between the resistor and the conductive shield. The isolation element electrically isolates the resistor from the conductive shield.

Abstract: Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.

Abstract: A compressible element for a sensor assembly includes an elastomer matrix having a first compressibility and a plurality of closed areas distributed within the elastomer matrix and each surrounded by the elastomer matrix. Each of the closed areas has a second compressibility greater than the first compressibility.

Abstract: A sensor assembly includes a sensor and an overload stop disposed on a surface of the sensor. The sensor has a resilient central region and an outer region surrounding the central region. The overload stop includes a center stop disposed on the central region and a peripheral stop disposed on the outer region.

Abstract: A multi-turn measurement system includes a plurality of gears, a plurality of pinions engaging the plurality of gears, a plurality of magnets each disposed on one of the plurality of gears, and a plurality of magnetic field sensors. Rotation of the pinions about a center axis drives rotation of the plurality of gears. The magnets each have a magnetic field that changes based on an angular position of the one of the plurality of gears. The magnetic field sensors are each positioned to sense the magnetic field of one of the plurality of magnets.

Abstract: The sensor assembly comprises a sensor die comprising first and second members. The first member accommodates an actuation element on a second surface of the first member and in contact with a diaphragm that is integral with the first member. The second member is bonded to a first surface of the first member opposite the second surface, and sensing elements are positioned adjacent the diaphragm along the first surface and interposed between the first and second members. The second member also includes a recessed section that forms a cavity adjacent the diaphragm to accommodate and/or limit diaphragm deflection. An internal electrical connection is made between first and second member electrical contacts disposed along the interface between the first and second members to avoid external wires. The second member further includes external electrical terminals to facilitate an electrical surface connection with the sensor assembly without the need for external wires.

Abstract: A pressure sensing device includes a support structure, an isolated diaphragm, a working oil, and a MEMS die sensing element. The support structure defines a portion of a sealed cavity. The isolated diaphragm is mounted to the support structure. The isolated diaphragm has in inner side that defines an end of the sealed cavity and an outer side opposite the inner side. The working oil is contained within the sealed cavity. The MEMS die sensing element is enclosed within the support structure. The MEMS die sensing element is exposed to the working oil within the sealed cavity. A pressure exerted on the outer side of the isolated diaphragm by a fluid medium is transferred via the working oil to the MEMS die sensing element to measure the pressure of the fluid medium. The working oil has a low vapor pressure and a low volatility content.